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Board Thickness:Shows as photo
Surface treatment: ENIG
Via is an important component for multi layer PCBAs. Printed circuit boards are superimposed by copper foil circuit layer upon layer, and the connection between the different circuit layers is the via. There are three most common via are plating through hole, blind hole and buried hole.
Plating Through Hole(PTH)
PTH is the most common via, just take up PCB and face to the light, if you can see the light, then it is the “through hole”. PTH is also the simplest kind of hole because it just need to use drill or laser light to make a full borehole.
Blind Via Hole(BVH)
Connect the outermost circuit of the PCB and the adjacent inner layer with plated through-hole, since we cannot see the opposite, so it is called “blind pass”. In order to increase the space utilization of PCB circuit layer, blind via hole came into being.
Buried Via Hole (BVH)
Buried via hole connects to any circuit layer of PCB but do not pass to the outer layer. This process cannot be done using the method of bonding after drilling, it must be in the individual circuit layer when the implementation of drilling, the first part of the internal bonding after the first plating treatment, and finally all the bonding.
You can know more clearly about the above three hole based on the below chart.
Flow Chart :
|Rigid PCB Capability|
|Materials||Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic,|
Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco
|Max. PCB Panel Size||1496mmx620mm|
|Board Thickness Tolerance||±10%|
|Min Conductor Line Trace/Space||Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper)|
Via in Pad
|Resin plugged hole size||0.3-0.75mm|
|Resin plugged board thickness||0.3-8mm|
|Resin plugged maximum aspect ratio||20:1|
|Resin plugged minimum hole to hole space(mm)||0.65mm|
|For HDI||Min. mechanical drilling hole diameter||0.15mm|
|Min. laser drilling hole diameter||0.075mm|
|Max. dielectric thickness for laser drill||0.05-0.15mm|
|Bottom pad size(under micro-via)||Hole Size+0.17mm|
|Top side pad size(on micro-via)||Hole Size+0.15mm|
|Via in pad design||Y|
|Buried hole resin plugged||Y|
|Min. via size can be copper filled||0.075mm|
|Min plated hole size||20um(0.8mil)|
|Min Blind/Buried hole size||0.2mm(8mil)|
|Min Annular Ring||±0.076mm(±3mil)|
|Min width of cutout (NPTH)||0.8mm|
|Min width of slot hole (PTH)||0.6mm|
|Solder mask color||green, red, blue, white, yellow, purple, black, orange, LPI, matt green|
|Silkscreen color||White, Yellow, Red, Black|
|Surface finish||ENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver|
|Outline||Routing, V-cut, Bridge, Stamp hole|
|Outline Tolerance||±0.15mm (±6mil)|
|Hole Tolerance||PTH +/-3mil|
|Controled Impendence||+/-5%(<50Ω), +/-10%(≧50Ω)|
|E-Test||Flying probe test:0.4-6.0mm, max 19.6"*23.5"|
|Min spacing from test pad to board edge:0.5mm|
|Min conductive resistance:5Ω|
|Max insulation resistance:250mΩ|
|Max test voltage:500V|
|Min test pad diameter:6mil|
|Min test pad to pad spacing:10mil|
|Max test pad to pad spacing:10mil|
|Max test current:200MA|
|AOI||Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5"|
|Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5"|
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