Dear Customers, Welcome to MINKINZI-China Leading Manufacturer for FPC, Rigid Flexible PCB, Rigid PCB and PCBA, Jun. 09 2020 Tuesday .
Description :
Rigid PCBs are printed circuit boards that are made out of a solid substrate material that prevents the board from twisting. Possibly the most common example of a rigid PCB is a computer motherboard. The motherboard is a multilayer PCB designed to allocate electricity from the power supply while simultaneously allowing communication between all of the many parts of the computer, such as CPU, GPU and RAM.
These PCBs are used anywhere that there is a need for the PCB itself to be set up in one shape and remain that way for the remainder of the device's lifespan. Rigid PCBs can be anything from a simple single-layer PCB all the way up to an eight or ten-layer multi-layer PCB.
Applications :
Flow Chart :
Capability :
Rigid PCB Capability | ||
Layers | ≦36 | |
Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
Max. PCB Panel Size | 1496mmx620mm | |
Board Thickness | 0.2-12mm | |
Board Thickness Tolerance | ±10% | |
Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
Outer Layers:≧3.5/3.5mil | ||
For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
Resin plugged board thickness | 0.3-8mm | |
Resin plugged maximum aspect ratio | 20:1 | |
Resin plugged minimum hole to hole space(mm) | 0.65mm | |
For HDI | Min. mechanical drilling hole diameter | 0.15mm |
Min. laser drilling hole diameter | 0.075mm | |
Max. aspect(micro-via) | 1:1 | |
Max. dielectric thickness for laser drill | 0.05-0.15mm | |
Bottom pad size(under micro-via) | Hole Size+0.17mm | |
Top side pad size(on micro-via) | Hole Size+0.15mm | |
Copper filling | Y | |
Via in pad design | Y | |
Buried hole resin plugged | Y | |
Min. via size can be copper filled | 0.075mm | |
Min plated hole size | 20um(0.8mil) | |
Min Blind/Buried hole size | 0.2mm(8mil) | |
Min Annular Ring | ±0.076mm(±3mil) | |
Min width of cutout (NPTH) | 0.8mm | |
Min width of slot hole (PTH) | 0.6mm | |
Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green | |
Silkscreen color | White, Yellow, Red, Black | |
Surface finish | ENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver | |
Outline | Routing, V-cut, Bridge, Stamp hole | |
Outline Tolerance | ±0.15mm (±6mil) | |
Hole Tolerance | PTH +/-3mil | |
NPTH +/-2mil | ||
Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
Min spacing from test pad to board edge:0.5mm | ||
Min conductive resistance:5Ω | ||
Max insulation resistance:250mΩ | ||
Max test voltage:500V | ||
Min test pad diameter:6mil | ||
Min test pad to pad spacing:10mil | ||
Max test pad to pad spacing:10mil | ||
Max test current:200MA | ||
AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" |
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Dongguan Minkinzi Plant,No.8,Industry South Rd., Songshan Lake High-Tech Dist., DaLang, Dongguan,China.523770.