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  • HDI PCB 05

  • HDI PCB 05

  • HDI PCB 05

HDI PCB 05

Layers:12

Material:FR-4/TG170

Board Thickness: 1.6mm

Copper thickness:2oz (70um) 

Steps:3+N+3

Surface treatment:ENIG

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Description :

HDI PCBs offer much higher wiring densities per area than standard circuit boards, with finer lines and spaces, smaller vias and higher connection pad density. HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

We can offer The HDI PCBs support Blind and/or buried vias,Via-in-pad,Through vias from surface to surface, microvias.

HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices as well as various electronic aircraft parts, components, semiconductor test equipment, defense, and aerospace.


Applications :

HDI PCB

Flow Chart :

HDI PCB

Capability :

Rigid PCB Capability
Layers≦36
MaterialsStandard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic,
Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco
Max. PCB Panel Size1496mmx620mm
Board Thickness0.2-12mm
Board Thickness Tolerance±10%
Min Conductor Line Trace/SpaceInner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper)
Outer Layers:≧3.5/3.5mil
For
Via in Pad
Resin plugged hole size0.3-0.75mm
Resin plugged board thickness0.3-8mm
Resin plugged maximum aspect ratio20:1
Resin plugged minimum hole to hole space(mm)0.65mm
For HDIMin. mechanical drilling hole diameter0.15mm
Min. laser drilling hole diameter0.075mm
Max. aspect(micro-via)1:1
Max. dielectric thickness for laser drill0.05-0.15mm
Bottom pad size(under micro-via)Hole Size+0.17mm
Top side pad size(on micro-via)Hole Size+0.15mm
Copper fillingY
Via in pad designY
Buried hole resin pluggedY
Min. via size can be copper filled0.075mm
Min plated hole size20um(0.8mil)
Min Blind/Buried hole size0.2mm(8mil)
Min Annular Ring±0.076mm(±3mil)
Min width of cutout (NPTH)0.8mm
Min width of slot hole (PTH)0.6mm
Solder mask colorgreen, red, blue, white, yellow, purple, black, orange, LPI, matt green
Silkscreen colorWhite, Yellow, Red, Black
Surface finishENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver
OutlineRouting, V-cut, Bridge, Stamp hole
Outline Tolerance±0.15mm (±6mil)
Hole TolerancePTH +/-3mil
NPTH +/-2mil
Controled Impendence+/-5%(<50Ω), +/-10%(≧50Ω)
E-TestFlying probe test:0.4-6.0mm, max 19.6"*23.5"
Min spacing from test pad to board edge:0.5mm
Min conductive resistance:5Ω
Max insulation resistance:250mΩ
Max test voltage:500V
Min test pad diameter:6mil
Min test pad to pad spacing:10mil
Max test pad to pad spacing:10mil
Max test current:200MA
AOIOrbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5"
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5"



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+86 0769 3320 0710

sales@minkinzi.com

http://www.minkinzi.com

Dongguan Minkinzi Plant,No.8,Industry South Rd., Songshan Lake High-Tech Dist., DaLang, Dongguan,China.523770.

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