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  • Heavy Copper PCB 06

  • Heavy Copper PCB 06

  • Heavy Copper PCB 06

Heavy Copper PCB 06

Layers:4

Material:FR-4/TG170

Copper thickness:5oz

Material:FR4 all TGs, Aluminum,

Ceramic, Polyimide, and Teflons., etc.

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Description :

Heavy copper PCB is also called as Thick copper PCB. Generally, the PCBs with 3OZ copper or more on the inner or outer layers, treated as heavy copper PCB.

Heavy copper circuit boards can be built on but not limited to FR4 all TGs, Aluminum, Ceramic, Polyimide, and Teflons.

Heavy copper PCB used for Welding Equipment,Power suppliers,Solar Panel,Automotive,Electrical Power Distribution,Power Converters.


Applications :

Heavy Copper PCB

Flow Chart :

Heavy Copper PCB

Capability :

Rigid PCB Capability
Layers≦36
MaterialsStandard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic,
Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco
Max. PCB Panel Size1496mmx620mm
Board Thickness0.2-12mm
Board Thickness Tolerance±10%
Min Conductor Line Trace/SpaceInner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper)
Outer Layers:≧3.5/3.5mil
For
Via in Pad
Resin plugged hole size0.3-0.75mm
Resin plugged board thickness0.3-8mm
Resin plugged maximum aspect ratio20:1
Resin plugged minimum hole to hole space(mm)0.65mm
For HDIMin. mechanical drilling hole diameter0.15mm
Min. laser drilling hole diameter0.075mm
Max. aspect(micro-via)1:1
Max. dielectric thickness for laser drill0.05-0.15mm
Bottom pad size(under micro-via)Hole Size+0.17mm
Top side pad size(on micro-via)Hole Size+0.15mm
Copper fillingY
Via in pad designY
Buried hole resin pluggedY
Min. via size can be copper filled0.075mm
Min plated hole size20um(0.8mil)
Min Blind/Buried hole size0.2mm(8mil)
Min Annular Ring±0.076mm(±3mil)
Min width of cutout (NPTH)0.8mm
Min width of slot hole (PTH)0.6mm
Solder mask colorgreen, red, blue, white, yellow, purple, black, orange, LPI, matt green
Silkscreen colorWhite, Yellow, Red, Black
Surface finishENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver
OutlineRouting, V-cut, Bridge, Stamp hole
Outline Tolerance±0.15mm (±6mil)
Hole TolerancePTH +/-3mil
NPTH +/-2mil
Controled Impendence+/-5%(<50Ω), +/-10%(≧50Ω)
E-TestFlying probe test:0.4-6.0mm, max 19.6"*23.5"
Min spacing from test pad to board edge:0.5mm
Min conductive resistance:5Ω
Max insulation resistance:250mΩ
Max test voltage:500V
Min test pad diameter:6mil
Min test pad to pad spacing:10mil
Max test pad to pad spacing:10mil
Max test current:200MA
AOIOrbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5"
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5"



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sales@minkinzi.com

http://www.minkinzi.com

Dongguan Minkinzi Plant,No.8,Industry South Rd., Songshan Lake High-Tech Dist., DaLang, Dongguan,China.523770.

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