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  • High Frequency PCB 02

  • High Frequency PCB 02

  • High Frequency PCB 02

High Frequency PCB 02

Layers:2

Material:Teflon

 Board Thickness:3mm

Copper thickness:2oz (70um)

Surface treatment:Immersion Gold

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Description :

High Frequency (HF) PCB can be defined as frequency above 1GHz. Currently, PTFE (polyfluortetraethylene) is widely used in high frequency PCB manufacturing,also called Teflon, which frequency is normally above 5GHz. In addition, FR4 or PPO substrate can be used to the product frequency among 1GHz~10GHz.These make it ideally suited for high-speed designs, as well as radio frequency (RF), microwave and mobile applications Electronic devices with high frequency is the developing tendency nowadays, especially in wireless network. Satellite communication growing rapidly, information products move towards high speed and high frequency. 


Applications :

High Frequency PCB 02

Flow Chart :

High Frequency PCB 02

Capability :

Rigid PCB Capability
Layers≦36
MaterialsStandard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic,
Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco
Max. PCB Panel Size1496mmx620mm
Board Thickness0.2-12mm
Board Thickness Tolerance±10%
Min Conductor Line Trace/SpaceInner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper)
Outer Layers:≧3.5/3.5mil
For 
Via in Pad
Resin plugged hole size0.3-0.75mm
Resin plugged board thickness0.3-8mm
Resin plugged maximum aspect ratio20:1
Resin plugged minimum hole to hole space(mm)0.65mm
For HDIMin. mechanical drilling hole diameter0.15mm
Min. laser drilling hole diameter0.075mm
Max. aspect(micro-via)1:1
Max. dielectric thickness for laser drill0.05-0.15mm
Bottom pad size(under micro-via)Hole Size+0.17mm
Top side pad size(on micro-via)Hole Size+0.15mm
Copper fillingY
Via in pad designY
Buried hole resin pluggedY
Min. via size can be copper filled0.075mm
Min plated hole size20um(0.8mil)
Min Blind/Buried hole size0.2mm(8mil)
Min Annular Ring±0.076mm(±3mil)
Min width of cutout (NPTH)0.8mm
Min width of slot hole (PTH)0.6mm
Solder mask colorgreen, red, blue, white, yellow, purple, black, orange, LPI, matt green
Silkscreen colorWhite, Yellow, Red, Black
Surface finish ENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver
OutlineRouting, V-cut, Bridge, Stamp hole
Outline Tolerance±0.15mm (±6mil)
Hole TolerancePTH +/-3mil
NPTH +/-2mil
Controled Impendence+/-5%(<50Ω), +/-10%(≧50Ω)
E-TestFlying probe test:0.4-6.0mm, max 19.6"*23.5"
Min spacing from test pad to board edge:0.5mm
Min conductive resistance:5Ω
Max insulation resistance:250mΩ
Max test voltage:500V
Min test pad diameter:6mil
Min test pad to pad spacing:10mil
Max test pad to pad spacing:10mil
Max test current:200MA
AOIOrbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5"
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5"



Knowledge

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+86 0769 3320 0710

sales@minkinzi.com

http://www.minkinzi.com

Dongguan Minkinzi Plant,No.8,Industry South Rd., Songshan Lake High-Tech Dist., DaLang, Dongguan,China.523770.

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