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Layers:2
Material:Taconic
Board Thickness:1.2mm
Copper thickness:1oz (35um)
Surface treatment:Immersion Tin
Description :
High Frequency (HF) PCB can be defined as frequency above 1GHz. Currently, PTFE (polyfluortetraethylene) is widely used in high frequency PCB manufacturing,also called Teflon, which frequency is normally above 5GHz. In addition, FR4 or PPO substrate can be used to the product frequency among 1GHz~10GHz.These make it ideally suited for high-speed designs, as well as radio frequency (RF), microwave and mobile applications Electronic devices with high frequency is the developing tendency nowadays, especially in wireless network. Satellite communication growing rapidly, information products move towards high speed and high frequency.
Applications :
Flow Chart :
Capability :
Rigid PCB Capability | ||
Layers | ≦36 | |
Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
Max. PCB Panel Size | 1496mmx620mm | |
Board Thickness | 0.2-12mm | |
Board Thickness Tolerance | ±10% | |
Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
Outer Layers:≧3.5/3.5mil | ||
For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
Resin plugged board thickness | 0.3-8mm | |
Resin plugged maximum aspect ratio | 20:1 | |
Resin plugged minimum hole to hole space(mm) | 0.65mm | |
For HDI | Min. mechanical drilling hole diameter | 0.15mm |
Min. laser drilling hole diameter | 0.075mm | |
Max. aspect(micro-via) | 1:1 | |
Max. dielectric thickness for laser drill | 0.05-0.15mm | |
Bottom pad size(under micro-via) | Hole Size+0.17mm | |
Top side pad size(on micro-via) | Hole Size+0.15mm | |
Copper filling | Y | |
Via in pad design | Y | |
Buried hole resin plugged | Y | |
Min. via size can be copper filled | 0.075mm | |
Min plated hole size | 20um(0.8mil) | |
Min Blind/Buried hole size | 0.2mm(8mil) | |
Min Annular Ring | ±0.076mm(±3mil) | |
Min width of cutout (NPTH) | 0.8mm | |
Min width of slot hole (PTH) | 0.6mm | |
Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green | |
Silkscreen color | White, Yellow, Red, Black | |
Surface finish | ENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver | |
Outline | Routing, V-cut, Bridge, Stamp hole | |
Outline Tolerance | ±0.15mm (±6mil) | |
Hole Tolerance | PTH +/-3mil | |
NPTH +/-2mil | ||
Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
Min spacing from test pad to board edge:0.5mm | ||
Min conductive resistance:5Ω | ||
Max insulation resistance:250mΩ | ||
Max test voltage:500V | ||
Min test pad diameter:6mil | ||
Min test pad to pad spacing:10mil | ||
Max test pad to pad spacing:10mil | ||
Max test current:200MA | ||
AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" |
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