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  • High TG PCB 05

  • High TG PCB 05

  • High TG PCB 05

High TG PCB 05

Layers:2

Raw material:Rogers(R04350B)

Tg Value:170

Board Thickness:1.6mm

Copper thickness:1oz (35um) 

Surface treatment:Immersion Gold


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Description :

High-Tg (HTg) PCB is also called high-temperature PCB .Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 – 140℃, High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB.

As the rapid development of electric industry, especially for the computer as the representative of electronic products, developing toward the high performance, high multilayer requires PCB substrate material with higher heat resistance to ensure high reliability. On the other hand, as a result of development of SMT, CMT with high density pcb assembly technology, the PCB manufacturing with small hole size, fine lines and thin thickness are more and more inseparable from the support of high heat resistance.

Typical PCB materials for high temperature include  ITEQ-IT-180A, ISOLA 370HR, Shengyi S1000-2, etc.

These PCBs are used in Multilayer boards with many layers, Industrial electronics,Automobile electronics, Fine line trace structures, High temperature electronics.


Applications :

High Tg PCB

Flow Chart :

High Tg PCB

Capability :

Rigid PCB Capability
Layers≦36
MaterialsStandard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic,
Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco
Max. PCB Panel Size1496mmx620mm
Board Thickness0.2-12mm
Board Thickness Tolerance±10%
Min Conductor Line Trace/SpaceInner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper)
Outer Layers:≧3.5/3.5mil
For
Via in Pad
Resin plugged hole size0.3-0.75mm
Resin plugged board thickness0.3-8mm
Resin plugged maximum aspect ratio20:1
Resin plugged minimum hole to hole space(mm)0.65mm
For HDIMin. mechanical drilling hole diameter0.15mm
Min. laser drilling hole diameter0.075mm
Max. aspect(micro-via)1:1
Max. dielectric thickness for laser drill0.05-0.15mm
Bottom pad size(under micro-via)Hole Size+0.17mm
Top side pad size(on micro-via)Hole Size+0.15mm
Copper fillingY
Via in pad designY
Buried hole resin pluggedY
Min. via size can be copper filled0.075mm
Min plated hole size20um(0.8mil)
Min Blind/Buried hole size0.2mm(8mil)
Min Annular Ring±0.076mm(±3mil)
Min width of cutout (NPTH)0.8mm
Min width of slot hole (PTH)0.6mm
Solder mask colorgreen, red, blue, white, yellow, purple, black, orange, LPI, matt green
Silkscreen colorWhite, Yellow, Red, Black
Surface finishENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver
OutlineRouting, V-cut, Bridge, Stamp hole
Outline Tolerance±0.15mm (±6mil)
Hole TolerancePTH +/-3mil
NPTH +/-2mil
Controled Impendence+/-5%(<50Ω), +/-10%(≧50Ω)
E-TestFlying probe test:0.4-6.0mm, max 19.6"*23.5"
Min spacing from test pad to board edge:0.5mm
Min conductive resistance:5Ω
Max insulation resistance:250mΩ
Max test voltage:500V
Min test pad diameter:6mil
Min test pad to pad spacing:10mil
Max test pad to pad spacing:10mil
Max test current:200MA
AOIOrbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5"
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5"



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