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  • Impedance Control PCB 02

  • Impedance Control PCB 02

  • Impedance Control PCB 02

Impedance Control PCB 02

Layers:4

Material:FR4 Tg150

Board Thickness:1.6mm

Min Blind/Buried hole size:0.2mm(8mil)

Surface treatment: ENIG

Impedance Control:single ended 50,

differential 110Ω+/-10%

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Description :

Impedance is the combination of the capacitance and inductance of a circuit when operated at high frequency. Though also measured in Ohms, it is somewhat different than resistance which is a DC characteristic. Impedance is an AC characteristic, meaning that it is related to frequency, resistance is not. 

Controlled impedance should be used, when a signal must have a particular impedance in order to function properly. In high frequency applications matching the impedance of PCB traces is important in maintaining data integrity and signal clarity. If the impedance of the PCB trace connecting two components does not match the components' characteristic impedance, there may be increased switching times within the device or the circuit. There may also be random errors.

Impedance Control PCB are used in Telecommunications, Computing 100MHz and above, High Quality Analog Video, Signal Processing, RF Communication, etc.


Applications :

Impedance Control PCB

Flow Chart :

Impedance Control PCB

Capability :

Rigid PCB Capability
Layers≦36
MaterialsStandard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic,
Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco
Max. PCB Panel Size1496mmx620mm
Board Thickness0.2-12mm
Board Thickness Tolerance±10%
Min Conductor Line Trace/SpaceInner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper)
Outer Layers:≧3.5/3.5mil
For
Via in Pad
Resin plugged hole size0.3-0.75mm
Resin plugged board thickness0.3-8mm
Resin plugged maximum aspect ratio20:1
Resin plugged minimum hole to hole space(mm)0.65mm
For HDIMin. mechanical drilling hole diameter0.15mm
Min. laser drilling hole diameter0.075mm
Max. aspect(micro-via)1:1
Max. dielectric thickness for laser drill0.05-0.15mm
Bottom pad size(under micro-via)Hole Size+0.17mm
Top side pad size(on micro-via)Hole Size+0.15mm
Copper fillingY
Via in pad designY
Buried hole resin pluggedY
Min. via size can be copper filled0.075mm
Min plated hole size20um(0.8mil)
Min Blind/Buried hole size0.2mm(8mil)
Min Annular Ring±0.076mm(±3mil)
Min width of cutout (NPTH)0.8mm
Min width of slot hole (PTH)0.6mm
Solder mask colorgreen, red, blue, white, yellow, purple, black, orange, LPI, matt green
Silkscreen colorWhite, Yellow, Red, Black
Surface finishENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver
OutlineRouting, V-cut, Bridge, Stamp hole
Outline Tolerance±0.15mm (±6mil)
Hole TolerancePTH +/-3mil
NPTH +/-2mil
Controled Impendence+/-5%(<50Ω), +/-10%(≧50Ω)
E-TestFlying probe test:0.4-6.0mm, max 19.6"*23.5"
Min spacing from test pad to board edge:0.5mm
Min conductive resistance:5Ω
Max insulation resistance:250mΩ
Max test voltage:500V
Min test pad diameter:6mil
Min test pad to pad spacing:10mil
Max test pad to pad spacing:10mil
Max test current:200MA
AOIOrbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5"
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5"



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