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Dear Customers, Welcome to MINKINZI-China Leading Manufacturer for FPC, Rigid Flexible PCB, Rigid PCB and PCBA, Mar. 30 2020 Monday .

  • PCBA 04

  • PCBA 04

  • PCBA 04


Prototype PCB Assembly

Low-Volume PCB Assembly

Consigned PCB Assembly 

High Volume PCB Assembly

Fully Turnkey PCB Assembly

Conformal coating


Description :

In assembly the bare board is populated (or "stuffed") with electronic components to form a functional printed circuit assembly (PCA), sometimes called a "printed circuit board assembly" (PCBA).

In through-hole technology, the component leads are inserted in holes surrounded by conductive pads; the holes keep the components in place.

In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side components are glued to the board. In both through hole and surface mount, the components are then soldered; once cooled and solidified, the solder holds the components in place permanently and electrically connects them to the board.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Or, even if all components are available in through-hole packages, it might be desired to take advantage of the size, weight, and cost reductions obtainable by using some available surface-mount devices. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress (such as connectors that are frequently mated and demated or that connect to cables expected to impart substantial stress to the PCB-and-connector interface), while components that are expected to go untouched will take up less space using surface-mount techniques.

Applications :


Capability :

PCBA Capability
Stencil Size Range736mm x 736mm(28.97"X28.97")
SMTPosition accuracy: 20um
Components size: 0.4*0.2mm -130*79mm, chip, QFP, BGA, POP
Max. PCB Size: 680mm x500mm
Min.PCB size:no limited
Min. PCB Thickness: 0.3 to 6mm
Min. IC Pitch: 0.30mm
Min. Chip Size : 0201(0.2" x 0.1") / 0603 (0.6mmx 0.3mm)
Wave-SolderMax.PCB width: 450
Min.PCB width: no Limited
Component height: Top 120mm/Bot 15mm
Min BGA and Micro BGA pitch and ball counts0.008"(0.2mm) pitch, ball count greater than 1000
Max. BGA Size74mm x74mm
BGA Ball Pitch1.00mm (Min); 3.00mm (Max)
BGA Ball Diameter0.40mm (Min); 1.00mm (Max)
QFP Lead Pitch0.38mm (Min); 2.54mm (Max)
Assembly surface mount connectorsyes
TestingX-Ray , AOI, Microscope to 20x, ICT, Function test, Temperature cycling.
PCB shapeall
Frequency of Stencil Cleaning1 time / 5 ~ 10 Pieces


Contact Us

+86 0769 3320 0710

Dongguan Minkinzi Plant,No.8,Industry South Rd., Songshan Lake High-Tech Dist., DaLang, Dongguan,China.523770.

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