Dear Customers, Welcome to MINKINZI-China Leading Manufacturer for FPC, Rigid Flexible PCB, Rigid PCB and PCBA, Oct. 09 2019 Wednesday .
Prototype PCB Assembly
Low-Volume PCB Assembly
Consigned PCB Assembly
High Volume PCB Assembly
Fully Turnkey PCB Assembly
In assembly the bare board is populated (or "stuffed") with electronic components to form a functional printed circuit assembly (PCA), sometimes called a "printed circuit board assembly" (PCBA).
In through-hole technology, the component leads are inserted in holes surrounded by conductive pads; the holes keep the components in place.
In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side components are glued to the board. In both through hole and surface mount, the components are then soldered; once cooled and solidified, the solder holds the components in place permanently and electrically connects them to the board.
Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Or, even if all components are available in through-hole packages, it might be desired to take advantage of the size, weight, and cost reductions obtainable by using some available surface-mount devices. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress (such as connectors that are frequently mated and demated or that connect to cables expected to impart substantial stress to the PCB-and-connector interface), while components that are expected to go untouched will take up less space using surface-mount techniques.
|Stencil Size Range||736mm x 736mm(28.97"X28.97")|
|SMT||Position accuracy: 20um|
|Components size: 0.4*0.2mm -130*79mm, chip, QFP, BGA, POP|
|Max. PCB Size: 680mm x500mm|
|Min.PCB size:no limited|
|Min. PCB Thickness: 0.3 to 6mm|
|Min. IC Pitch: 0.30mm|
|Min. Chip Size : 0201(0.2" x 0.1") / 0603 (0.6mmx 0.3mm)|
|Wave-Solder||Max.PCB width: 450|
|Min.PCB width: no Limited|
|Component height: Top 120mm/Bot 15mm|
|Min BGA and Micro BGA pitch and ball counts||0.008"(0.2mm) pitch, ball count greater than 1000|
|Max. BGA Size||74mm x74mm|
|BGA Ball Pitch||1.00mm (Min); 3.00mm (Max)|
|BGA Ball Diameter||0.40mm (Min); 1.00mm (Max)|
|QFP Lead Pitch||0.38mm (Min); 2.54mm (Max)|
|Assembly surface mount connectors||yes|
|Testing||X-Ray , AOI, Microscope to 20x, ICT, Function test, Temperature cycling.|
|Frequency of Stencil Cleaning||1 time / 5 ~ 10 Pieces|
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