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  • Rigid Flexible PCB 13

  • Rigid Flexible PCB 13

  • Rigid Flexible PCB 13

Rigid Flexible PCB 13

Layers: 12 Layers 
Base laminate materials:FR-4/polyimide
FPC thickness: 0.6mm
Copper thickness: 4 oz

Surface finish: ENIG

Technology:Blind and Buried Via


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Description :

Rigid-flex circuits are a hybrid construction flex circuit consisting of rigid and flexible substrates which are laminated together into a single structure. Rigid-flex circuits should not be confused with rigidized flex constructions, which are simply flex circuits to which a stiffener is attached to support the weight of the electronic components locally. A rigidized or stiffened flex circuit can have one or more conductor layers. Thus while the two terms may sound similar, they represent products that are quite different.


Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.


Applications :

Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.


In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles.


Flow Chart :

Rigid Flexible PCB 01

Capability :

Rigid flexible PCB Capability
Layers≦16 Layers
Base MaterialsKapton, Polyimide, PET,FR4(for rigid part),Customer requested
Stiffener MaterialsPolyimide, PET, FR4, SUS,Customer requested
Max. Panel Size32"*20.5"(800mmx520mm)
Min. Buried Via/PAD0.4mm/1.0mm
Min. Distance from Via to Line0.3mm
Min.Track Width/Space0.051mm/0.051mm
Min hole-drilling size0.2mm
Min hole-punching size0.5mm
Aspect Ratio6:1
Base Copper1/4Oz--3Oz
Surface TreatmentENIG: 0.025um - 3um;Immersion Tin: 0.04-1.5um;OSP
Min pad5mil(0.13mm)
Min finished hole size0.15mm
Outline Tolerance±0.075mm
Hole Registration±0.050mm
Conductor Width tolerance±10%
Hole wall thickness10-50um
Max hole-plugging size0.7mil
Solder mask tolerance50+/-10%, 75+/-10%, 100+/-10%
Peel strenth1.0kgf/cm(IPC-TM-650)
Solder Float288℃/10s(IPC Standard)
Flammability94V-O(UL94)



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