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Description :
Rigid-flex circuits are a hybrid construction flex circuit consisting of rigid and flexible substrates which are laminated together into a single structure. Rigid-flex circuits should not be confused with rigidized flex constructions, which are simply flex circuits to which a stiffener is attached to support the weight of the electronic components locally. A rigidized or stiffened flex circuit can have one or more conductor layers. Thus while the two terms may sound similar, they represent products that are quite different.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Applications :
Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.
In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles.
Flow Chart :
Capability :
| Layers | 4-128(for rigid-flex circuits);1-30(for flex circuits) | |
| Base Materials | Kapton, Polyimide, PET,FR4(for rigid part),Customer requested,any other materials, customer can confirm with us. | |
| Stiffener Materials | Polyimide, PET, FR4, SUS,Customer requested | |
| Max board size | 3000mm*520mm | |
| Min. Buried Via/PAD | 0.4mm/1.0mm | |
| Min. Distance from Via to Line | 0.3mm | |
| Min.Track Width/Space | 0.051mm/0.051mm | |
| Min hole-drilling size | 0.2mm | |
| Min hole-punching size | 0.5mm | |
| Aspect Ratio | 20:1 | |
| Base Copper | 1/4Oz--13Oz | |
| Surface Treatment | ENIG: 0.025um - 3um;Immersion Tin: 0.04-1.5um;OSP,any other surface treatment, customer can confirm with us. | |
| Min pad | 5mil(0.13mm) | |
| Min finished hole size | 0.15mm | |
| Outline Tolerance | ±0.05mm | |
| Hole Registration | ±0.05mm | |
| Conductor to Outline tolerance | ±0.1mm | |
| Conductor Width tolerance | ±10% | |
| Hole wall thickness | 10-50um | |
| Max hole-plugging size | 0.7mil | |
| Solder mask tolerance | 50+/-10%, 75+/-10%, 100+/-10% | |
| Peel strenth | 1.0kgf/cm(IPC-TM-650) | |
| Solder Float | 288℃/10s(IPC Standard) | |
| Flammability | 94V-O(UL94) | |
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