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Benefits of HDI PCB Technology with Micro Circuits:
Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.
Allows utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.
Allows utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.
Allows reducing the “time to market” equation by combining the process capabilities with a strong comprehension of high speed digital and high frequency RF PCB package requirements.
Increases the area for the PCB designer provider to place circuit components as the components are decreased in size and spaced much closer together.
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Difference of Blind Via Hole(BVHBuried Via Hole (BVH) and Plating Through Hole(PTH)
Connect the outermost circuit of the PCB and the adjacent inner layer with plated through-hole, since we cannot see the opposite, so it is called ...
Benefits of HDI PCB Technology with Micro Circuits
Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices. A...
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