Dear Customers, Welcome to MINKINZI-China Leading Manufacturer for FPC, Rigid Flexible PCB, Rigid PCB and PCBA, Mar. 30 2020 Monday .
Dear Customers, Welcome to MINKINZI-China Leading Manufacturer for FPC, Rigid Flexible PCB, Rigid PCB and PCBA, Mar. 30 2020 Monday .
Description :
HDI PCBs offer much higher wiring densities per area than standard circuit boards, with finer lines and spaces, smaller vias and higher connection pad density. HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.
We can offer The HDI PCBs support Blind and/or buried vias,Via-in-pad,Through vias from surface to surface, microvias.
HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices as well as various electronic aircraft parts, components, semiconductor test equipment, defense, and aerospace.
Applications :
Flow Chart :
Capability :
| Rigid PCB Capability | ||
| Layers | ≦36 | |
| Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
| Max. PCB Panel Size | 1496mmx620mm | |
| Board Thickness | 0.2-12mm | |
| Board Thickness Tolerance | ±10% | |
| Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
| Outer Layers:≧3.5/3.5mil | ||
| For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
| Resin plugged board thickness | 0.3-8mm | |
| Resin plugged maximum aspect ratio | 20:1 | |
| Resin plugged minimum hole to hole space(mm) | 0.65mm | |
| For HDI | Min. mechanical drilling hole diameter | 0.15mm |
| Min. laser drilling hole diameter | 0.075mm | |
| Max. aspect(micro-via) | 1:1 | |
| Max. dielectric thickness for laser drill | 0.05-0.15mm | |
| Bottom pad size(under micro-via) | Hole Size+0.17mm | |
| Top side pad size(on micro-via) | Hole Size+0.15mm | |
| Copper filling | Y | |
| Via in pad design | Y | |
| Buried hole resin plugged | Y | |
| Min. via size can be copper filled | 0.075mm | |
| Min plated hole size | 20um(0.8mil) | |
| Min Blind/Buried hole size | 0.2mm(8mil) | |
| Min Annular Ring | ±0.076mm(±3mil) | |
| Min width of cutout (NPTH) | 0.8mm | |
| Min width of slot hole (PTH) | 0.6mm | |
| Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green | |
| Silkscreen color | White, Yellow, Red, Black | |
| Surface finish | ENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver | |
| Outline | Routing, V-cut, Bridge, Stamp hole | |
| Outline Tolerance | ±0.15mm (±6mil) | |
| Hole Tolerance | PTH +/-3mil | |
| NPTH +/-2mil | ||
| Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
| E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
| Min spacing from test pad to board edge:0.5mm | ||
| Min conductive resistance:5Ω | ||
| Max insulation resistance:250mΩ | ||
| Max test voltage:500V | ||
| Min test pad diameter:6mil | ||
| Min test pad to pad spacing:10mil | ||
| Max test pad to pad spacing:10mil | ||
| Max test current:200MA | ||
| AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
| Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" | ||
Difference of Blind Via Hole(BVHBuried Via Hole (BVH) and Plating Through Hole(PTH)
Connect the outermost circuit of the PCB and the adjacent inner layer with plated through-hole, since we cannot see the opposite, so it is called ...
Benefits of HDI PCB Technology with Micro Circuits
Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices. A...
+86 0769 3320 0710
Dongguan Minkinzi Plant,No.8,Industry South Rd., Songshan Lake High-Tech Dist., DaLang, Dongguan,China.523770.
