Dear customer, welcome to MINKINZI-China leading manufacturer for flex circuit, rigid flex circuit, rigid PCB and PCBA, Aluminum substrate, Copper substrate and glass substrate circuit board, LED Transparent circuit board,etc. Especially Difficult Projects. .
Layers:8 Steps:3+N+3
Material:FR-4/TG170
Board Thickness:1.6mm
Copper thickness:2oz (70um)
Surface treatment: ENIG
Min.line width/sapcking:
0.1mm/0.1mm ( impedance 100Ω)
Description :
HDI PCBs offer much higher wiring densities per area than standard circuit boards, with finer lines and spaces, smaller vias and higher connection pad density. HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.
We can offer The HDI PCBs support Blind and/or buried vias,Via-in-pad,Through vias from surface to surface, microvias.
HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices as well as various electronic aircraft parts, components, semiconductor test equipment, defense, and aerospace.
Applications :
Flow Chart :
Capability :
| Layers | 1-136 | |
| Technology | Blind and Buried Via, HDI,Hollow out, Selective Hard gold plating,Depth Control,Press fit hole, Edge Half-plated hole, Back drill, Countersink hole, Plated edge, Peelable solder mask, Imedance control, Gold Finger, Fill via with resin and other technology. | |
| Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM 3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
| Max. PCB Panel Size | 9000mmx820mm | |
| Board Thickness | 0.2-12mm | |
| Board Thickness Tolerance | ±10% | |
| Copper thickness | 0.5 OZ to 22 OZ | |
| copper thickness in hole | copper thickness in hole: >25.0 um(>1mil) | |
| Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
| Outer Layers:≧3.5/3.5mil | ||
| For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
| Resin plugged board thickness | 0.3-8mm | |
| Resin plugged maximum aspect ratio | 40:1 | |
| Resin plugged minimum hole to hole space(mm) | 0.65mm | |
| For HDI | Min. mechanical drilling hole diameter | 0.15mm |
| Min. laser drilling hole diameter | 0.075mm | |
| Max. aspect(micro-via) | 1:1 | |
| Max. dielectric thickness for laser drill | 0.05-0.15mm | |
| Bottom pad size(under micro-via) | Hole Size+0.17mm | |
| Top side pad size(on micro-via) | Hole Size+0.15mm | |
| Copper filling | Y | |
| Via in pad design | Y | |
| Buried hole resin plugged | Y | |
| Min. via size can be copper filled | 0.075mm | |
| Min plated hole size | 20um(0.8mil) | |
| Min Blind/Buried hole size | 0.2mm(8mil) | |
| Min Annular Ring | ±0.076mm(±3mil) | |
| Min width of cutout (NPTH) | 0.8mm | |
| Min width of slot hole (PTH) | 0.6mm | |
| Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green,matt black | |
| Silkscreen color | White, Yellow, Red, Black | |
| Surface finish | ENIG, ENEPIG,Immersion Tin, HASL, HASL-LF, OSP,Selective OSP, Gold finger, Immersion Silver,Bare Copper,Hard gold plating, Selective hard gold plating,Selective Immersion gold,Selective gold plating,HASL-LF+Selective Immersion gold,HASL-LF+Selective gold plating,HASL-LF+OSP,and other surface treatments. | |
| Outline | Routing, V-cut, Bridge, Stamp hole | |
| Outline Tolerance | ±0.15mm (±6mil) | |
| Hole Tolerance | PTH +/-3mil | |
| NPTH +/-2mil | ||
| Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
| E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
| Min spacing from test pad to board edge:0.5mm | ||
| Min conductive resistance:5Ω | ||
| Max insulation resistance:250mΩ | ||
| Max test voltage:500V | ||
| Min test pad diameter:6mil | ||
| Min test pad to pad spacing:10mil | ||
| Max test pad to pad spacing:10mil | ||
| Max test current:200MA | ||
| AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
| Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" | ||
| Profiling | Punching,Routing, V-CUT,Beveling | |
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Songshan Lake International Creativity Design Industry Park,No. 10, West Industrial Road,Songshan Lake High-Tech Dist.,Dongguan,China.523808.
