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Layer:16,
Material:Megatron 6,Rogers 4450B.
Unit Size:381x254mm,
Finished Board Thickness:2.6mm,
Surface Treatment: Gold Plating 2U,
Solder Mask:Green,
Silkscreen:White,
IPC Class 3.
Description :
Rogers PCB based on Rogers material : RT/Duroid 5880, RT/Duroid 5870, RT/Duroid 6002, RT/Duroid 6006, RT/Duroid 6010, Rogers 3003, Rogers 3006, Rogers 3010, Rogers 3203, Rogers 3210, Rogers 4003C, Rogers 4350B, Rogers 4450B.
These PCBs are widely used in Cellular Base Station Antennas and Power Amplifiers, Microwave point to point (P2P) links, Automotive Radar and Sensors,RF Identification (RFID) Tags.
Applications :
Flow Chart :
Capability :
Layers | 1-136 | |
Technology | Blind and Buried Via, HDI,Hollow out, Selective Hard gold plating,Depth Control,Press fit hole, Edge Half-plated hole, Back drill, Countersink hole, Plated edge, Peelable solder mask, Imedance control, Gold Finger, Fill via with resin and other technology. | |
Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM 3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
Max. PCB Panel Size | 9000mmx820mm | |
Board Thickness | 0.2-12mm | |
Board Thickness Tolerance | ±10% | |
Copper thickness | 0.5 OZ to 22 OZ | |
copper thickness in hole | copper thickness in hole: >25.0 um(>1mil) | |
Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
Outer Layers:≧3.5/3.5mil | ||
For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
Resin plugged board thickness | 0.3-8mm | |
Resin plugged maximum aspect ratio | 40:1 | |
Resin plugged minimum hole to hole space(mm) | 0.65mm | |
For HDI | Min. mechanical drilling hole diameter | 0.15mm |
Min. laser drilling hole diameter | 0.075mm | |
Max. aspect(micro-via) | 1:1 | |
Max. dielectric thickness for laser drill | 0.05-0.15mm | |
Bottom pad size(under micro-via) | Hole Size+0.17mm | |
Top side pad size(on micro-via) | Hole Size+0.15mm | |
Copper filling | Y | |
Via in pad design | Y | |
Buried hole resin plugged | Y | |
Min. via size can be copper filled | 0.075mm | |
Min plated hole size | 20um(0.8mil) | |
Min Blind/Buried hole size | 0.2mm(8mil) | |
Min Annular Ring | ±0.076mm(±3mil) | |
Min width of cutout (NPTH) | 0.8mm | |
Min width of slot hole (PTH) | 0.6mm | |
Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green,matt black | |
Silkscreen color | White, Yellow, Red, Black | |
Surface finish | ENIG, ENEPIG,Immersion Tin, HASL, HASL-LF, OSP,Selective OSP, Gold finger, Immersion Silver,Bare Copper,Hard gold plating, Selective hard gold plating,Selective Immersion gold,Selective gold plating,HASL-LF+Selective Immersion gold,HASL-LF+Selective gold plating,HASL-LF+OSP,and other surface treatments. | |
Outline | Routing, V-cut, Bridge, Stamp hole | |
Outline Tolerance | ±0.15mm (±6mil) | |
Hole Tolerance | PTH +/-3mil | |
NPTH +/-2mil | ||
Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
Min spacing from test pad to board edge:0.5mm | ||
Min conductive resistance:5Ω | ||
Max insulation resistance:250mΩ | ||
Max test voltage:500V | ||
Min test pad diameter:6mil | ||
Min test pad to pad spacing:10mil | ||
Max test pad to pad spacing:10mil | ||
Max test current:200MA | ||
AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" | ||
Profiling | Punching,Routing, V-CUT,Beveling |
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