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106 Layer Shengyi SH260 PCB
Application:ADAS Camera & Millimeter-Wave Radar Modules, AI server
Material in stock:Rogers,Arlon,Taconic,Teflon,Isola,ITEQ,Dupont,Polyimide,Ventec,Nelco, Taiyao, Megatron M6,M7,M8,M9,etc.
| Shengyi S1000-2 | Rogers RT/duroid 5880 | SH 260 |
| Isola 370HR | Rogers RT/duroid 5870 | Arlon 85N |
| Isola 408HR | Rogers RO3003 | Nelco N7000-2 HT |
| ITEQ IT-180A | Panasonic R-5775 (MEGTRON M6,M7,M8,M9) | Nelco N7000-3 |
| ITEQ IT-180B | Ventec VT901 | Shengyi Tg200 |
| Rogers RO4003C | EMC EM-370 | Taiyao TU933+ |
| Rogers RO4350B | Rogers RO4450F/RO4450B | Isola Tachyon 100G |
| IT-180ABS | IT-180ATC | RO3000,RO4000,RT5880,RT6010 |
Description :
Shengyi SH260 is a high Tg (medium glass transition temperature) FR-4 copper-clad laminate material manufactured by Guangdong Shengyi Technology. It stands as a representative model in the classic medium Tg series, with performance characteristics that strategically fall between traditional FR-4 and high Tg materials. It is specifically engineered for electronic devices with medium performance requirements, making it a versatile choice across countless commercial and industrial applications.
As a trusted Shengyi SH260 manufacturer with years of experience working with this laminate, we recognize SH260 as one of the most balanced and cost-effective substrates in Shengyi's product lineup. For engineers searching for a Shengyi SH260 replacement material that offers reliable performance without the premium price of ultra-high Tg alternatives, this laminate consistently delivers exceptional value.
Good Heat Resistance and Dimensional Stability – Compared to ordinary FR-4, SH260 performs more stably in high-temperature scenarios such as reflow soldering and thermal shock, ensuring long-term reliability across demanding operating environments.
Excellent Electrical Properties – Stable dielectric constant makes SH260 suitable for medium-frequency applications, including signal integrity-sensitive designs.
Good Machinability – Easy to drill, mill, and press-fit, reducing manufacturing complexity and improving production yield.
Stable CTI Performance – Strong comparative tracking index resistance enhances safety in high-voltage designs.
Cost Advantage – More competitively priced compared to high Tg series such as S1000 and S1150, allowing customers seeking favorable Shengyi SH260 price points to optimize their BOM cost without sacrificing quality.
Good CAF Resistance – Strong resistance to ion migration (Conductive Anodic Filament formation) ensures field reliability.
Environmental Compliance – Fully complies with RoHS, REACH, HF, and other international environmental directives.
SH260 is mainly suitable for mid-range electronic products that require certain heat resistance but remain cost-sensitive. It is widely deployed across consumer electronics, home appliances, power supplies, LED lighting, automotive electronics, communication equipment, and industrial control. As an established Shengyi SH260 distributor serving global markets, we consistently maintain Shengyi SH260 in stock across our standard thicknesses and copper weights to support rapid customer demand.
Within consumer electronics, SH260 demonstrates exceptional versatility across handheld, wearable, and personal computing devices. The material's balance of thermal performance, electrical stability, and affordability makes it an industry-preferred choice for high-volume consumer products.
The home appliance sector represents one of the largest application domains for SH260. Its excellent performance under elevated humidity, thermal cycling, and high-current conditions makes it ideal for modern smart home devices that demand both reliability and cost efficiency.
SH260's thermal stability and electrical performance make it particularly suitable for LED lighting applications where heat management and long-term reliability are critical factors. Customers looking to buy Shengyi SH260 online for lighting projects benefit from consistent material availability and standardized processing parameters.
The automotive electronics segment demands materials with exceptional reliability across extreme temperature ranges and long service life requirements. SH260 meets these rigorous demands while remaining accessible for cost-sensitive automotive applications. For automotive OEMs seeking a qualified Shengyi SH260 supplier with IATF 16949 certification, our factory delivers fully compliant solutions.
Industrial applications leverage SH260 for its robust thermal performance and ability to handle high-current, high-voltage designs. The material's reliability under continuous thermal stress makes it ideal for industrial-grade equipment that operates around the clock in demanding environments.
Communication infrastructure demands precise impedance control and signal integrity. SH260's stable dielectric properties enable reliable performance for medium-frequency communication equipment, while remaining flexible enough for hybrid stack-up designs that incorporate higher-frequency materials locally.
After selecting SH260 material, choosing a qualified PCB factory becomes the decisive factor in product success. We recommend evaluating the following dimensions to ensure your supplier aligns with both your technical requirements and business objectives.
Customers should first verify whether the factory possesses official authorization or cooperative certification from Shengyi Technology. A reputable supplier must be able to provide original material certificates from Shengyi, including UL labels, batch traceability codes, and material certificates. Verify that the factory has passed ISO 9001, ISO 14001, and—for automotive applications—IATF 16949 system certifications. Environmental compliance documentation including RoHS, REACH, and HF certifications should be readily available upon request.
Process capability determines whether a factory can deliver your specific design requirements. Key evaluation areas include layer count coverage (1–6 layers, with HDI capability), board thickness range (0.4mm–3.2mm with thick board capability), copper thickness options (0.5–6oz thick copper process), minimum line width and spacing capability (3mil/3mil or 4mil/4mil), and surface treatment variety including HASL, ENIG, OSP, immersion tin, and immersion silver. Special process capabilities such as impedance control, solder bridges, and crimp holes should also be confirmed based on project needs.
Strong engineering support differentiates a competent manufacturer from a basic fabrication house. Look for DFM (Design for Manufacturability) review capability that can identify design risks before production. Confirm impedance control capability with proper impedance testers and TDR testing equipment. Verify AOI + Flying Probe/ICT test coverage along with reliability testing capabilities including thermal shock, reflow soldering, CAF, and IST. A documented first article approval process indicates quality discipline.
Standard delivery expectations should include samples within 5–8 days and bulk orders within 10–15 days. Confirm the factory's urgent order response capability (24–72 hour expedited processing) and ensure their monthly production capacity aligns with your order volume requirements.
Request comprehensive quotations including unit price, mold fee, testing fee, and shipping cost. Evaluate pre-sales and after-sales service response speed. Determine whether value-added services such as OEM/ODM, BOM optimization, and component procurement are available to streamline your supply chain.
Request evidence of similar application cases, customer reviews, export experience, and overseas certifications. Has the factory served globally recognized brands or industry-leading clients? This track record often predicts future performance quality.
Minkinzi is a professional manufacturer of mid-to-high-end PCBs maintaining a close long-term partnership with Shengyi Technology. We are a mature application manufacturer of classic Shengyi materials including SH260, with a modern production base in South China possessing complete SMT and PCB full-process service capabilities from material preparation to finished products.
As an established Shengyi SH260 manufacturer with deep materials expertise, we serve customers across global markets with consistent quality, reliable lead times, and competitive pricing structures. Whether you need small-batch prototyping or large-scale Shengyi SH260 bulk order fulfillment, our infrastructure scales to meet your demands.
With over ten years of collaboration with Shengyi Technology, our engineering team possesses precise knowledge of SH260 lamination, drilling, and etching parameters. We have established a comprehensive Shengyi material inventory system, with over 5,000 sheets of commonly used specifications maintained in stock at any given time. Our formal material procurement channels ensure that every Shengyi SH260 in stock is accompanied by complete material certificates and UL labels for full traceability.
When customers explore Shengyi SH260 replacement material options or alternative Shengyi materials, our technical team provides consultative guidance to identify the most suitable substrate for each application.
Our layer coverage extends from 1–16 layers, with SH260 primarily deployed in 1–6 layer products. Monthly production capacity exceeds 50,000 square meters, supported by board thickness capabilities ranging from 0.2mm–3.2mm and copper thickness options from 0.5oz–6oz. We deliver minimum line width and spacing of 3mil/3mil and offer complete surface treatment options including HASL, ENIG, OSP, Immersion Tin, Immersion Silver, and Gold Plating with full coverage.
Our quality infrastructure includes AOI (Automated Optical Inspection), X-Ray, and TDR (Time Domain Reflectometry) equipment throughout the production flow. Certifications include ISO 9001, ISO 14001, IATF 16949, and UL. We strictly adhere to IPC-A-600 and IPC-6012 standards, and provide first article confirmation, reliability test reports, and FA reports for every project. As a quality-focused Shengyi SH260 distributor, we guarantee traceability and consistency across every shipment.
We have delivered over 5 million SH260 PCB products across diverse industries including consumer electronics, home appliances, power supplies, LED lighting, automotive electronics, industrial control, and communication equipment. Our long-term partnerships include numerous Fortune 500 companies and leading domestic brands, validating our capability to support the most demanding customer requirements.
Beyond PCB manufacturing, we offer comprehensive value-added services including SMT placement, DIP insertion, post-soldering, testing, and complete system assembly. Our facility is equipped with four high-speed placement lines capable of mounting micro-components as small as 01005. We support full BOM procurement and component sourcing models to reduce customer supply chain pressure and accelerate time-to-market.
We understand that different customers have different volume requirements. Our Shengyi SH260 MOQ starts at just 1 square meter for prototypes, scaling efficiently to support Shengyi SH260 bulk order volumes exceeding 10,000 square meters per month. This flexibility makes us equally suitable for R&D institutions requiring small-batch production and large OEMs needing stable bulk supply.
Sample delivery is available in as little as 24 hours for urgent requirements, with hourly express service options. Standard lead time for bulk orders is 10 days. We possess extensive overseas export experience, with products delivered to North America, Europe, Southeast Asia, the Middle East, South America, and additional global regions.
Each client receives dedicated one-on-one account manager service available in both Chinese and English, along with flexible trade terms including DDP, DDU, CIF, and FOB. When you request a SH260 PCB quote from our team, you receive comprehensive pricing transparency including all tooling, testing, and logistics costs.
Minkinzi Factory sincerely welcomes global clients to visit and discuss cooperation opportunities. Whether you represent small and medium-sized innovative enterprises requiring rapid prototyping and verification, large brand owners requiring stable and reliable bulk supply, R&D institutions requiring flexible production of small batches and multiple varieties, or overseas traders needing to source high-quality PCBs from China, we provide customized solutions tailored to your unique business model.
Quality Commitment – 100% factory yield rate with free repair or replacement for any defective products.
Delivery Commitment – On-time delivery rate maintained at ≥ 98%.
Price Commitment – Best value for money with attractive discounts available for bulk orders. Our transparent Shengyi SH260 price structure ensures you receive competitive market rates without hidden fees.
Service Commitment – 24/7 global response with one-on-one service from professional engineers throughout every project phase.
Confidentiality Commitment – NDA confidentiality agreements available to protect your proprietary designs and business information.
When you choose to buy Shengyi SH260 online through our platform or via direct consultation, you gain access to a complete supply chain solution backed by engineering expertise, quality assurance, and global logistics capabilities. Our reputation as a trusted Shengyi SH260 supplier is built on consistent delivery performance and customer satisfaction across thousands of successful projects.
Contact Information
For inquiries, quotations, technical consultation, or to discuss your specific Shengyi SH260 PCB requirements, please reach out to our sales team at Email: sales@minkinzi.com. We respond to all inquiries within 24 hours and look forward to supporting your next project with the quality, reliability, and service excellence that define the Minkinzi difference.
Minkinzi Factory – Your Trusted Partner for Shengyi SH260 PCB Manufacturing and Global Supply.
Applications :
Professional PCB manufacturing services using Shengyi SH260 materials | High-multilayer | High-speed signal | Strict quality control | On-time delivery | Factory-direct pricing
Shengyi SH260 is a medium-to-high Tg, low-loss substrate developed by Shengyi Technology specifically for high-speed digital and high-frequency applications. Engineered to deliver exceptional signal integrity, thermal reliability, and stable high-frequency performance, SH260 has become the substrate of choice for mid-to-high-end electronic devices across the world's most demanding industries. As a Shengyi SH260 factory direct manufacturer with first-tier material distribution rights, Minkinzi PCB delivers dependable Shengyi SH260 wholesale price advantages alongside vertically integrated production capabilities.
When you order Shengyi SH260 laminate through Minkinzi, you gain access to fully traceable material batches, ample on-hand stock, and a complete in-house PCB fabrication workflow — from DFM engineering and stack-up optimization to assembly and global logistics.
The SH260 platform has been widely adopted across data center, automotive, telecom, industrial, medical, and commercial electronics. Below are thirty representative end products where Shengyi SH260 PCBs deliver proven performance:
As SH260 for consumer electronics PCB and SH260 for telecom equipment designs continue to push bandwidth higher and form factors smaller, manufacturers increasingly rely on SH260's stable Dk/Df characteristics and high Tg reliability. The laminate's robust thermal endurance supports a wide spectrum of everyday and mission-critical devices:
Consumer Electronics
Smartphones — Main and sub PCBs for mid-range 4G/5G devices, leveraging SH260's stable high-speed signal performance.
Tablets — Motherboards and display driver boards benefit from SH260's low-loss dielectric behavior.
Laptops / Notebooks — Main logic boards and power management boards requiring multilayer reliability.
Smart Watches / Wearables — Compact multilayer PCBs in space-constrained enclosures.
Wireless Earbuds — Charging case and main PCBs optimized for tight layouts and low power loss.
Action Cameras (e.g., GoPro) — Compact high-density interconnect boards with stable impedance.
Game Consoles (PS5, Xbox, Switch) — Main logic and peripheral boards handling high-speed interfaces.
Computing & Peripherals
Desktop PCs — Motherboards and GPU auxiliary boards with high-speed signal integrity.
Computer Monitors — Display control boards built on SH260's thermally robust platform.
External SSDs — High-speed storage device PCBs requiring tight impedance control.
Hard Disk Drives (HDDs) — Control logic boards with extended reliability requirements.
Printers / Multifunction Devices — Main control and driver boards across product generations.
Network Routers / Modems — Wi-Fi 6/6E routers and gateways, ideal examples of SH260 for telecom equipment applications.
Smart Home & Display
LED / LCD TVs — T-CON boards and power boards, where SH260 for LED lighting PCB durability translates into long-life display performance.
Set-Top Boxes — Signal processing PCBs supporting high-throughput media streams.
Smart Speakers (Echo, Google Home) — Audio processing motherboards with low-loss signal paths.
VR / AR Headsets — Display and computing modules demanding compact high-speed routing.
Streaming Devices (Fire TV, Chromecast) — Multimedia PCBs for always-connected consumer devices.
Automotive Electronics
In-Vehicle Infotainment Systems — Main display and control modules where Shengyi SH260 for automotive PCB quality ensures automotive-grade reliability.
ADAS Control Modules — Camera and radar processing boards with stable impedance behavior at high frequencies.
Body Control Modules (BCM) — Lighting, window, and sensor control across vehicle networks.
EV Charging Stations — Power and communication PCBs, a flagship use of Shengyi SH260 for power supply applications.
Dash Cameras — Video recording and storage control boards.
Industrial & Power
Industrial PLC Controllers — Factory automation main boards using SH260 for industrial control PCB reliability.
Solar Inverters — Power conversion control PCBs leveraging Shengyi SH260 for power supply thermal resilience.
Switching Power Supplies (SMPS) — High-efficiency power conversion boards.
Power Banks — Battery management system (BMS) boards requiring consistent multilayer quality.
Uninterruptible Power Supplies (UPS) — Monitoring and control boards for critical-power infrastructure.
Specialized Applications
Medical Patient Monitors — High-reliability signal processing boards meeting stringent medical standards.
Consumer Drones (e.g., DJI) — Flight controller and ESC PCBs optimized for compact, high-speed designs.
IoT Devices — Compact, low-power connected devices benefit from Shengyi SH260 for IoT devices deployments across smart home, asset tracking, and industrial sensing markets.
Customers expect their manufacturing partner to maintain complete system certifications — ISO 9001, ISO 14001, IATF 16949 (Automotive), AS9100 (Aerospace), and UL Certification. Environmental compliance with RoHS, REACH, halogen-free, and other eco-friendly material systems is non-negotiable, and facilities must be ready to pass audits conducted by leading international brands.
Production capability must cover high-multilayer boards from 12-layer up to 30+ layer stack-ups. Required equipment includes:
LDI laser direct imaging for line accuracy within ±2 mil
Laser drilling machines (CO₂ / UV) supporting 0.1 mm micro-hole processing
Back drilling machines controlling stub ≤ 6 mil
Vacuum presses engineered for SH260 high-Tg lamination
Automatic TDR impedance testers with ±5% impedance control capability
A competent partner provides a dedicated DFM (Design for Manufacturability) team offering free stack-up optimization, supports SI (Signal Integrity) simulation, delivers impedance matching and routing recommendations tailored to SH260 material characteristics, and offers CAM engineering services including copper thickness uniformity and dielectric layer thickness optimization.
Stable procurement channels for high-speed materials — including first-tier agency access to SH260 — short material preparation cycles supporting expedited requests, and complete material incoming inspection processes are essential pillars of a reliable factory-direct supply chain.
Every PCB factory must navigate a defined set of technical hurdles when working with SH260. The table below highlights the most common pain points, the underlying causes, and the process controls required to resolve them at scale.
Every incoming batch of SH260 laminate undergoes Dk/Df sampling inspection to verify board-to-board consistency. Copper foil thickness, appearance, and storage environment are strictly controlled, while prepreg (PP) flowability and gel time are tested against release specifications.
AOI + AVI automated optical inspection at 100% coverage
Impedance online sampling inspection at 5% per batch
SPC statistical process control with Cpk ≥ 1.33 on key processes
PTH / electroplating process monitored online for through-hole copper thickness and plating uniformity
Lamination process with full temperature rise curve recording and pressure curve traceability
100 % appearance + AOI full inspection
Flying probe / test stand 100 % electrical testing (E-Test)
Customer-provided Gerber netlist comparison (CAM350 / Valor)
Each shipment includes complete SPC, Cpk, and impedance reports
8D report with 24-hour response to customer complaints
FMEA + Control Plan with full process coverage
Quality traceability system with unique barcode per board, supporting forward and reverse traceability
Continuous improvement mechanism including monthly QBR and quality data dashboards
On-time delivery rate (OTD) ≥ 98 %, with strict adherence to committed delivery dates and proactive warnings for any potential delay. Expedited order response capability through a 12–48 hour rapid prototyping channel supports urgent engineering timelines.
Flexible switching across multiple varieties, small batches, and highly complex boards. Monthly capacity scales from samples (5 pcs) to large batches (5 000+ m²), with a dedicated line for high-multilayer boards that keeps critical work separate from ordinary board production.
A dedicated MES order query system lets customers view real-time production status — from material feeding, lamination, drilling, solder mask, testing, through to shipping. Automatic SMS / email / WeChat notifications flag key milestones along the way.
Strategic partnerships with DHL / FedEx / UPS enable worldwide delivery in 3–5 days. Domestic delivery within Jiangsu, Zhejiang, and Shanghai arrives in 24 hours, while the Pearl River Delta and Beijing-Tianjin-Hebei region receive shipments within 48 hours. Optional VMI (Vendor Managed Inventory) mode and one-stop export customs declaration with tax refund support international customers.
Every shipment includes an impedance test report, certificate of conformity, reliability test report, COC, and MSDS. Electronic Gerber alignment diagrams, stack-up diagrams, and assembly drawings are provided, with production data retained for a minimum of five years.
Shengyi SH260 deserves a manufacturing partner that specializes in its characteristics. Minkinzi delivers more stable signals, more reliable quality, and more worry-free delivery — backed by factory-direct pricing that makes every Shengyi SH260 wholesale price quote competitive for both prototype and volume runs.
Whether you need SH260 for consumer electronics PCB, Shengyi SH260 for automotive PCB, SH260 for LED lighting PCB, Shengyi SH260 for power supply modules, SH260 for industrial control PCB, Shengyi SH260 for IoT devices, or SH260 for telecom equipment, Minkinzi offers the engineering depth, supply stability, and quality discipline your project demands.
Welcome to contact Minkinzi factory to manufacture your Shengyi SH260 PCB. Email: sales@minkinzi.com
Flow Chart :
Applicable Applications: 5G Communication Base Stations, Automotive Millimeter-Wave Radar (77–79 GHz), Satellite Communication, AOI Industrial Radar, High-End Servers, Avionics Systems, Computer Motherboards, and High-Performance Computing Platforms
The Shengyi SH260 PCB is a low-loss, medium-to-high dielectric constant, medium dissipation factor high-speed laminate engineered for PTFE and modified resin system applications. Designed to deliver stable RF performance across demanding frequency bands, SH260 is widely adopted by leading OEMs seeking a high-performance alternative to the Rogers RO4000 series. As a trusted Shengyi SH260 contract manufacturer, Minkinzi leverages this material to deliver boards for 5G RF front-ends, Sub-6 GHz and mmWave modules, automotive radar systems, high-speed computer motherboards, and avionics platforms.
These properties make SH260 ideal for high-density interconnect designs and the full range of Shengyi SH260 multilayer PCB stack-ups, from a simple Shengyi SH260 2 layer PCB for RF modules to complex 8-layer HDI configurations for phased-array antennas.
The journey from concept to a manufacturable board begins with a comprehensive Design for Manufacturing (DFM) review. Minkinzi's engineering team translates customer RF performance targets, mechanical constraints, and cost expectations into a fully documented production package.
The target application dictates impedance tolerance and stack-up decisions. A 5G AAU may accept ±10% impedance tolerance, while a 77 GHz automotive radar front-end from a Tier 1 OEM typically demands ±5% or tighter. Satellite phased arrays, server backplanes, and high-performance SH260 computer motherboard designs each carry unique signal-integrity requirements.
Engineering accepts and verifies Gerber (RS-274X), ODB++, and IPC-2581 files. Netlist cross-checks and stack-up intent are validated against the chosen PCB architecture—whether a Shengyi SH260 rigid PCB, a Shengyi SH260 HDI PCB with stacked microvias, or a hybrid build-up.
Typical SH260 architectures range from a Shengyi SH260 2 layer PCB and Shengyi SH260 4 layer PCB up to an 8-layer Shengyi SH260 multilayer PCB. A common 4-layer configuration:
Top (Signal Layer) → SH260 Core + 2116 Prepreg → Inner Layer (Ground) → SH260 Core + 2116 Prepreg → Bottom (Signal Layer)
Minimum linewidth/spacing: ≥ 3/3 mil recommended; ≥ 4/4 mil preferred for 77 GHz
Drill annular ring: ≥ 6 mil (hole-to-copper ≥ 8 mil)
BGA via design: Proper HDI via structure with stacked or staggered microvias
Impedance reference continuity: No splits under controlled-impedance traces
Minkinzi's engineers use Polar Si9000 and HyperLynx to compute 50Ω single-ended and 90Ω/100Ω differential linewidths. Outputs include a full DFM report, stack-up diagram, impedance table, and process instructions ready for fabrication.
Once the DFM package is approved, the project moves to sample production. As a specialty Shengyi SH260 prototype PCB supplier, Minkinzi validates every process step before committing to mass production.
Laminate Verification: SH260 batch number, thickness tolerance (±10%), copper foil grade (RTF/HTE)
Copper Foil Roughness: Ra measurement (Rz ≤ 5 μm recommended for low insertion loss)
Storage Conditions: 23±3°C, 50±10% RH with shelf-life management
SH260 Critical Control: Because SH260 contains a PTFE/low-loss resin system, the inner copper surface must be aggressively roughened prior to browning. The lamination bond strength must reach ≥ 6 lb/in as verified by peel strength testing.
Recommended lamination parameters (reference values, calibrated per press):
Heating Curve: Room temperature → 150°C at 2–3°C/min → 180°C hold 30 min → 200°C hold 60–90 min
Pressure Curve: Initial 50 PSI → ramp to 200–350 PSI (layer-count dependent) → hold at high temperature
Vacuum: ≤ 50 mbar in vacuum laminator
Cooling Rate: ≤ 3°C/min to avoid Z-axis CTE mismatch
Key inspections: dielectric thickness per layer (±10%), filler fullness with no voids, and cross-section analysis for interlayer alignment and resin distribution.
Drill Rig: 6-axis high-speed drill, 80–120 krpm spindle, feed rate 2–5 m/min
Entry/Backing: Aluminum entry sheet + melamine backing to minimize burrs
Hole Diameter Tolerance: PTH ±0.05 mm; microvia ±0.025 mm
Hole Wall Quality: Nail head ≤ 25 μm, no halo, no resin smear
Post-Drilling Treatment: Plasma desmear (CF₄/O₂ system) + chemical etch
Drilling Challenge on SH260: The PTFE/low-Dk resin is prone to smear; combined plasma desmear plus chemical etch is mandatory to ensure reliable hole-wall copper to inner-layer copper connection.
Process sequence: desmear → etch → neutralize → pre-dip → activation (Pd colloid) → acceleration → electroless copper → electrolytic copper thickening.
Backlight Level: ≥ Grade 9 (out of 10)
Hole Copper Thickness: ≥ 25 μm (IPC Class 2); ≥ 30 μm (Class 3)
Similar to inner-layer processing, with the addition of pattern electroplating.
Copper Plating Thickness: ≥ 25 μm on signal traces (foil + plating)
Post-Etch Linewidth Tolerance: ±10% for ±10% impedance scenarios; ±15% for standard builds
Solder Mask: LPI (Liquid Photoimageable), colors green/black/blue/red
Thickness: 10–25 μm, covering copper ≥ 8 μm
Legend: White or yellow, UV-cured
SH260 Recommendation: For high-frequency Shengyi SH260 PCB assembly, ENIG or ENEPIG is preferred for its smooth surface finish, consistent impedance, and minimal impact on RF transmission performance.
CNC Routing: ±0.1 mm tolerance
V-CUT: 30°/45° angle, 1/3 board thickness remaining
Flying Probe Test: 100% open/short verification
Impedance Test: Polar CITS or TDR, sampled or 100%
Packaging: Vacuum bag + desiccant + ESD bag + humidity indicator card
Documentation: COC, cross-section report, impedance report, reliability report
PPAP / First Article Approval: Mandatory for automotive IATF 16949 programs
Capacity Planning: Aligns monthly demand (kpcs/m²) with raw material lead time
Equipment OEE Verification: Press, drill, copper plating line, electrolytic plating line, AOI
SPC Dashboards: Cpk ≥ 1.33 standard; ≥ 1.67 for critical processes
LDI Auto-Exposure: Replaces traditional film; alignment accuracy ±12.5 μm
Inline AOI: 100% per-piece inspection, defect ID ≥ 15 μm
Automated Impedance Test: Polar CITS, Atg Luther & Maelzer
X-Ray Coating Thickness: Inline Ni/Au/Pd monitoring
CCD Visual Inspection: Replaces manual visual checks
Thermal Stress: 288°C tin dip, 10 s × 3 cycles (IPC-TM-650 2.6.8)
IST (Interconnect Stress Test): 65°C → 260°C, 1000 cycles
CAF Test: 85°C / 85% RH / 50V, 500–1000 hours
High-Frequency Performance: Dk/Df via resonant cavity or SPP method
Cross-Section Analysis: Per-batch sampling under metallographic microscope
SIR (Surface Insulation Resistance): 100V / 35°C / 85% RH / 168 hours
Insufficient lamination bonding and resin smear during drilling are the two most frequent issues. The remedy: apply micro-etch roughening prior to browning to achieve a 1.5–3.0 μm oxide film, then run mandatory plasma desmear plus chemical etch after drilling to reach backlight ≥ Grade 9. Validate with regular peel strength testing at ≥ 6 lb/in.
OSP degrades after multiple reflow cycles and long-term storage. For high-frequency, high-reliability Shengyi SH260 PCB assembly, ENIG or ENEPIG provides a smoother surface, superior oxidation resistance, and tighter impedance control.
Differential impedance of 90 Ω or 100 Ω, single-ended 50 Ω, tolerance ±5% (some Tier 1 OEMs require ±5% on every trace). Requirements include: continuous impedance reference planes, no splits under controlled-impedance traces, Dk deviation ±0.05, and 100% TDR testing.
Vacuum bag + desiccant + humidity indicator card
Storage temperature 23±3°C, humidity ≤ 60% RH
Shelf life: ENIG 12 months, OSP 6 months
Use within 24 hours after vacuum bag opening
Using a Vector Network Analyzer (VNA) with microstrip test coupons:
S21 insertion loss (dB/inch)
Dk/Df @ 10 GHz / 28 GHz / 77 GHz
Time-domain impedance coherence (TDR)
✅ Shengyi SH260 Strategic Partner — Direct OEM channels with 5–10% pricing advantage on every Shengyi SH260 contract manufacturer engagement.
✅ IATF 16949 / ISO 9001 / UL Certified — Compliant with automotive OEM, 5G telecom, and military/aerospace requirements.
✅ 77 GHz Radar Mass Production Heritage — Over 100 delivered projects, minimum linewidth/spacing of 2.5/2.5 mil, including Shengyi SH260 2 layer PCB, Shengyi SH260 4 layer PCB, Shengyi SH260 multilayer PCB, and Shengyi SH260 HDI PCB architectures.
✅ Fully Automated Lines — LDI, inline AOI, automated impedance testing, Cpk ≥ 1.67 across critical processes.
✅ Free DFM + 48-Hour Quotation — Engineering team responds 24/7 to expedite your Shengyi SH260 prototype PCB needs.
✅ Complete Automotive Documentation — PPAP, IMDS, VDA 6.3, and full SH260 PCB fabrication service support including turnkey Shengyi SH260 PCB assembly.
Whether you need a Shengyi SH260 rigid PCB for an automotive radar module, a Shengyi SH260 multilayer PCB for a 5G base station, or a Shengyi SH260 HDI PCB for a high-end computer motherboard, Minkinzi delivers end-to-end Shengyi SH260 PCB fabrication service with the reliability, speed, and engineering depth your program demands.
Contact Minkinzi today for your Shengyi SH260 PCB fabrication and assembly needs. Email: sales@minkinzi.com
Capability :
In high-speed applications such as 5G communications, 400G/800G optical modules, AI servers, millimeter-wave radar, and high-end industrial control, Shengyi SH260 (Df≈0.0055 @10GHz, Dk≈3.6 @10GHz) has become the preferred domestic solution to replace some Rogers/Taconly mid-loss materials. With its high Tg laminate characteristics, exceptional signal integrity performance, and proven thermal reliability, SH260 is widely adopted in mission-critical designs. However, SH260's strict DSC control, high adhesion requirements for low-roughness copper, and narrow control window for lamination flow mean that not all PCB manufacturers can achieve stable mass production. As a trusted Shengyi SH260 OEM PCB service provider and one-stop SH260 PCB turnkey solution partner, Minkinzi factory has established a full-chain high-end process capability for SH260 and similar high-speed materials, covering material pretreatment, lamination, Shengyi SH260 impedance control, and high-frequency testing — making us the ideal choice for your high-speed PCB projects.
Material Understanding and Pre-treatment SH260 standard configuration includes RTF/HVLP copper foil combined with low-roughness browning treatment to prevent excessive etching of low-loss dielectric materials, thereby avoiding any adverse impact on the dissipation factor (Df). Every SH260 laminate, which is RoHS compliant, UL approved, and halogen free, is stored in a constant temperature and humidity (23±2℃ / 50±10% RH) environment, allowing lamination within 24 hours of material preparation to prevent moisture absorption and board bursting. This careful material handling reinforces SH260's renowned signal integrity performance and thermal reliability from the very first step of production.
High-Layer Lamination Capability Our lamination line supports a maximum of 32 layers, accommodating stacks of 8 sheets of SH260 combined with multiple sheets of high-speed prepreg. Maximum board thickness reaches 6.0mm with ±5% thickness tolerance control. The minimum linewidth/spacing capability is 2.5/2.5 mil (≈0.063mm), achieved using a vacuum press combined with MPPT pressure profiling to minimize white corners and adhesive slippage. We also support maximum copper thickness of 6oz, enabling mixed lamination of power boards and signal boards — a critical requirement for the high Tg laminate characteristics of SH260 that demand precise thermal management.
Impedance and Stack-up Simulation Minkinzi operates in-house Polar Si8000/Saturn impedance testing alongside customer-shared Si9000/iNEMI models. Our typical stack-up experience includes achieving 100Ω differential impedance with a 4-layer SH260 configuration (8/8/8/8 mil) and supporting 25Gbps long-distance backplane designs through hybrid 8-layer SH260+FR4 builds. Our Shengyi SH260 impedance control capability delivers ±8% tolerance for high-speed signals and ±10% for standard differential pairs, with 100% documented DDL reports provided for every order. This SH260 PCB turnkey solution approach ensures your design intent is preserved from simulation through to finished board.
High-Precision Patterns and Circuits We deploy Laser Direct Imaging (LDI) technology instead of traditional exposure methods, which makes it significantly easier to control linewidth tolerances (±10%) for dielectric constant-sensitive materials like SH260. Our high aspect ratio plating reaches 20:1 (8mil holes with 24µm copper), with back-drilled stubs of ≤0.15mm, fully supporting 56Gbps SerDes signal integrity. Mass production of controlled-depth drilling, back-drilling, and buried blind vias (including 2+N+2 and 3+N+3 configurations) is fully mature — leveraging SH260's high Tg laminate stability and thermal reliability to maintain precision through every thermal cycle.
Surface Treatment and High Heat Dissipation Compatibility Minkinzi is fully compatible with immersion gold, immersion silver, OSP, ENEPIG (wire bonding available), and selective immersion gold + OSP. We support buried copper blocks, embedded copper blocks, and silver paste thermal plate structures to address high-current heat dissipation requirements for AI accelerator cards. Combined with our SH260 IPC standard compliant processes, every surface treatment is engineered to preserve SH260's signal integrity performance while enhancing long-term thermal reliability.
Price Advantage: Through long-term pricing partnerships with Shengyi, Lianmao, and Nanya groups, our SH260 boards are priced 5–8% lower than competitors. Our in-house press and electroplating production line enables buried blind via structures at more than 15% lower cost than three-stage HDI processes. Transparent pricing for high-speed boards means impedance control fees, feeder testing fees, and micro-slicing fees are bundled into our Shengyi SH260 OEM PCB service — eliminating hidden charges and making our SH260 PCB turnkey solution truly cost-predictable.
Minkinzi is certified by ISO 9001, ISO 14001, IATF 16949, UL 796, IPC-A-600 Class 3, and IPC-6012 Class 3 / DS / 3/DS. Our SH260 manufacturing is fully IPC standard compliant, ensuring every board meets the industry's most stringent acceptance criteria.
Key process positions are governed by SPC+CPK control — including brown coating roughness Ra, C/D surface copper thickness, and lamination flow rate — with CPK ≥ 1.67 as the entry standard to safeguard the signal integrity performance that SH260 is known for. Every key product undergoes 100% feeder ICT testing, 100% TDR impedance testing (reinforcing our Shengyi SH260 impedance control discipline), 100% AOI, and AXI X-Ray inspection. Cross-section, metallographic, electrical performance (Dk/Df via SPP), and thermal stress (288℃ floating solder 10s / 60s) documentation is retained for each batch for five years, fully traceable to each part number. Our in-house -55~+150℃ high and low temperature cycling chamber provides long-term reliability verification of SH260's Tg>150℃ and thermal reliability characteristics — giving our customers absolute confidence in every shipment.
The cases below have been anonymized. Please contact us privately to obtain the complete prototyping report, cross-section diagrams, and impedance PDF documentation.
5G Base Station AAU 64T64R Array Board: A 12-layer SH260 + 2nd-order HDI build featuring 4oz inner layer power, back-drilled stub ≤0.2mm, and 100Ω differential impedance controlled to ±7%. Over 300,000 pieces shipped in batches, validating SH260's high Tg laminate stability and signal integrity performance in real-world deployment.
800G OSFP Optical Module Motherboard: A 6-layer SH260 + high-frequency RO4835 dual-band design with ±5% impedance control, 100% AOI, and X-Ray inspection — supplied to leading optical module customers as a flagship Shengyi SH260 OEM PCB service reference.
AI Server GPU Accelerator Card (OAM/UBB Board): A 16-layer SH260 + FR4 hybrid build with 3/3mil linewidth and integrated copper block heat dissipation, delivered to multiple domestic GPU customers and demonstrating exceptional thermal reliability under continuous high-load operation.
Industrial Millimeter-Wave Radar 77GHz Board: A 4-layer SH260 + RO3003 dual-voltage design covering the 5005–5007 band, with actual antenna installation and testing confirming VSWR ≤1.5 — a perfect showcase of SH260's signal integrity performance at millimeter-wave frequencies.
Automotive 4D Imaging Radar Board: Compliant with IATF 16949 and AEC-Q100 requirements, this 8-layer SH260 build with embedded copper blocks passed 1000 thermal cycles at -40~+125℃ without any abnormalities, proving outstanding thermal reliability for automotive-grade applications.
High-end Industrial Control FPGA Evaluation Board: A 20-layer SH260 + low-loss PP design supporting 100Gbps long-range backplane signaling, with CPK 1.83, deployed in communication backbone network equipment — a flagship SH260 PCB turnkey solution for high-performance computing.
Commercial Aerospace PCB Prototype: Successfully passed 100 temperature shock cycles at -55~+125℃ plus vacuum release testing, used in collaboration with a customer for a GEO satellite communication payload prototype — confirming SH260's high Tg laminate resilience in extreme environments.
Shengyi SH260 PCB Manufacturer
SH260 Multilayer High-Speed PCB Factory
800G Optical Module PCB OEM
High-Frequency High-Speed PCB Prototyping and SMT Support
AI Server PCB / GPU Accelerator Card PCB
Domestic High-End PCB Manufacturer Minkinzi
Early Stage: Free stack-up simulation and SI/PI joint review, saving design companies two weeks of DFM time. Our team understands the nuances of Shengyi SH260 impedance control and will help you optimize your stack-up from day one.
Mid-Stage: 1,000㎡+ of high-end materials including SH260, RO4350, RO3003, and SH250 are kept in stock, with emergency prototyping available within 72 hours. As a responsive Shengyi SH260 OEM PCB service partner, we move at the speed your project demands.
Late Stage: Full-process data archiving from impedance testing to assembly is provided, allowing your B-end clients to audit our factory at any time. Every board is RoHS compliant, UL approved, halogen free, and IPC standard compliant — documentation included. Our end-to-end SH260 PCB turnkey solution ensures that nothing is left to chance, from material certification to final shipment.
Welcome to contact Minkinzi factory to manufacture your Shengyi SH260 PCBs. As your dedicated Shengyi SH260 OEM PCB service partner, we deliver unmatched thermal reliability, verified signal integrity performance, precision Shengyi SH260 impedance control, and the high Tg laminate expertise that demanding applications require.
Contact us today: Email: sales@minkinzi.com
Advantages :
Shengyi SH260 Material Mastery As a leading manufacturer specializing in Shengyi SH260 PCB production, Minkinzi delivers expert handling of Shengyi SH260, a high-speed low-loss copper clad laminate (CCL) engineered for next-generation electronic designs. Our factory maintains stringent dielectric constant (DK) control within ±0.05 at 10GHz and dissipation factor (Df) of ≤0.005 at 10GHz, ensuring superior high-speed signal integrity for mission-critical applications. For engineers seeking detailed Shengyi SH260 specifications or a comprehensive Shengyi SH260 datasheet, our engineering team provides full technical documentation and Dk/Df curves tailored to your stack-up requirements.
HDI Specialization Minkinzi focuses on 4–6 order HDI using both Any-Layer HDI and mSAP (Modified Semi-Additive Process) routes, achieving minimum trace width and spacing of 2.5/2.5 mil (≈63μm). Whether you require standard FR4 material or premium Shengyi SH260 FR4 material for your HDI design, our process engineers optimize every layer for performance and manufacturability.
Impedance Control We deliver 10Ω–100Ω impedance tolerance of ±5% (typical ±8%), with full support for impedance design on 6+ layer boards using Shengyi SH260 substrate and other high-speed laminates. Our Polar CITS and Agilent 4294A impedance testers validate every critical net before shipment.
Quick-Turn Capability Standard lead time is 5–7 days, with expedited service of 48–72 hours available for urgent Shengyi SH260 PCB orders. We understand that high-speed design cycles demand rapid iteration, and our dedicated express line ensures your Shengyi SH260 CCL projects ship on time.
Engineering Support Minkinzi provides complimentary DFM inspection, stack-up optimization, and SI/PI simulation support for every project. Our engineering team is well-versed in Shengyi SH260 material datasheet parameters and will guide you through layer stack-up design, via planning, and impedance modeling at no additional cost.
Mechanical Drilling Our mechanical drilling capabilities support minimum hole diameters of 0.15mm (6mil), with hole diameter tolerance of ±0.05mm (≤0.3mm) and ±0.076mm (0.3–0.6mm). Hole wall roughness is held to ≤25μm in full compliance with IPC-6012 Class 3, and hole position accuracy reaches ±0.05mm. We achieve thickness-to-diameter ratios of 15:1 as standard, with up to 20:1 available through specialized processes — critical for any multilayer build using Shengyi SH260 PCB material.
Laser Drilling (HDI Core) Minkinzi operates both CO₂ and UV laser dual-process routes, enabling blind via production with minimum hole diameters of 75μm (3mil) and buried via apertures as small as 100μm (4mil). Depth accuracy reaches ±10μm, and our medium thickness window supports 0.05–0.21mm (2–8mil) dielectrics. Laser aperture alignment is maintained at ±15μm, and our plasma plus chemical desmear process ensures complete resin removal from aperture walls — essential for reliable Shengyi SH260 substrate lamination.
Advanced Via Structures
Resin Plugging Our resin plugging process combines silkscreen, vacuum plugging, and grinding to prevent BGA solder ball short circuits and improve SMT yield. Plug depth is controlled to ≤15μm per IPC-6012 Class 3, and we use premium plugging resins from Taiyo and Peters, with low shrinkage under 2% — fully compatible with Shengyi SH260 PCB laminate thermal expansion characteristics.
Copper Filling (VIPPO — Via In Pad Plated Over) Minkinzi's VIPPO process route integrates electroplated copper filling, grinding, and blackening to achieve plug depth of ≤10μm (controllable within ±5μm). Applicable aperture range spans 75–200μm, making this process ideal for BGA, QFN, and Flip-Chip packaging where thermal dissipation and electrical performance must be balanced. This is a standard recommendation in our Shengyi SH260 datasheet consultation services.
Solder Mask Plugging We deliver 100% solder mask coverage with dimple depth ≤25μm using LPI liquid photosensitive solder mask. Every plugged orifice passes 100% AOI inspection with zero pinholes, ensuring reliability on Shengyi SH260 FR4 material and other advanced substrates.
Sequential Lamination Minkinzi supports sequential lamination orders in configurations of 1+N+1, 2+N+2, 3+N+3, and 4+N+4, with a maximum of 4 lamination cycles. Overall board thickness tolerance is held to ±10%, and single-layer dielectric thickness tolerance is also controlled to ±10% — providing the precision required for Shengyi SH260 CCL multilayer stack-ups.
mSAP (Modified Semi-Additive Process) Our mSAP line achieves minimum linewidth and pitch of 2/2 mil (50μm/50μm), with copper thickness control from 15–30μm and impedance tolerance of ±5%. This process is the ideal choice for high-end servers, AI accelerator cards, and 5G baseband applications — particularly when paired with Shengyi SH260 substrate for optimal signal integrity.
High-Speed Material Processing
For clients comparing Shengyi SH260 specifications against competing high-speed materials, our engineers provide side-by-side datasheet analysis and cost-performance recommendations.
Surface Finish (≥8 Options) Minkinzi offers ENIG (chemical nickel-gold) with Ni 3–5μm and Au 0.05–0.1μm, ENEPIG (chemical nickel-palladium-gold) for wire bonding and soldering, OSP (organic solderability preservative) compliant with IPC-4554, immersion tin and silver per IPC-4553/4554, lead-free HASL, and hard gold or soft gold with thickness ranging from 0.025–0.05μm up to 0.1–0.3μm.
Special Process Our special process portfolio includes controlled depth drilling for precise back-drill management, edge plating and castellated holes, carbon ink printing for button boards, peelable mask and blue tape for selective gold plating protection, and stiffener and heatsink bonding using PI/FR4 reinforcing plates with aluminum or copper heatsinks.
Layer Count & Board Spec Minkinzi manufactures 1–30 layer HDI boards and up to 40-layer backplanes, with board thickness ranging from 0.20–6.0mm as standard. Maximum board size reaches 21" × 24" (533×610mm), inner layer copper thickness spans 1/3–2 oz, and outer layer copper ranges from 1/2–6 oz. Minimum core board thickness is 0.05mm (2mil) — supporting ultra-thin stack-ups with Shengyi SH260 PCB laminate as the primary dielectric.
AOI Automated Optical Inspection We deploy Orbotech, Koh Young, and Omron AOI systems with resolution ≤5μm, providing 100% inner and outer layer circuit inspection for every Shengyi SH260 PCB order.
X-Ray & CT Transparent Inspection Our 2D X-Ray systems from Orbotech and Nikon inspect BGA solder joints and via alignment, while 3D Micro-CT from MIUI and Zeiss delivers resolution ≤5μm for buried via and internal via structure analysis — critical for verifying Shengyi SH260 substrate layer integrity.
Flying Probe Tester Minkinzi uses Takaya and Atg Luther & Maelzer flying probe testers with minimum 50μm pitch test points, adjustable test voltage from 100–500V, and Kelvin four-wire testing with ±1% accuracy.
Impedance Test Our impedance testing capabilities include Polar CITS (100Hz–110MHz) and Agilent 4294A (up to 1GHz), with test tolerance of ±5% — ensuring every Shengyi SH260 CCL stack-up meets design targets.
Cross-Section & Microsection Metallographic Analysis Automated grinding stations paired with Leica, Olympus, and Zeiss metallographic microscopes analyze through-hole copper thickness, plating thickness, linewidth and spacing, dielectric thickness, and stack-up structure. SEM, SP, and EDX energy dispersive spectroscopy analysis are available upon request to verify Shengyi SH260 material datasheet compliance.
Other Inspection Capabilities Additional testing includes solderability testing, 288°C tin leaching thermal stress tests, DSC/TMA/TGA thermal analysis, SIR/CAF electrochemical migration reliability, halogen content testing per IEC 61249-2-21, and RoHS XRF analysis using Olympus and Thermo Fisher equipment.
Minkinzi maintains full compliance with IPC-6012 (Rigid PCB Performance Specification, Class 2/3/3A), IPC-A-600 (PCB Acceptability Standard), IPC-6016 (HDI PCB Performance Specification), IPC-SM-840 (Solder Mask Qualification), IPC-4552/4553/4554 (ENIG/Immersion Ag/OSP), IPC-4101 (Substrate Specification — including Shengyi SH260 rating), and IPC-TM-650 (Test Method Manual).
Additional compliance includes UL 796 (PCB Safety Standards covering RTI, CTI, and flame class), UL 94V-0 flame retardant rating, IEC 61249-2-21 halogen-free standard, RoHS 2.0 and REACH EU environmental directives, UL 746E polymer material certification, J-STD-003 solderability testing, and ASTM E595 outgassing test for aerospace-grade applications.
Minkinzi is your trusted partner for Shengyi SH260 CCL manufacturing, offering end-to-end support from Shengyi SH260 datasheet review through final assembly-ready PCB delivery. Whether you need high-volume production of Shengyi SH260 PCB material multilayer boards or rapid prototyping of Shengyi SH260 substrate stack-ups, our engineering team is ready to support your design.
Contact us today: Email: sales@minkinzi.com — Request your Shengyi SH260 specifications consultation, free DFM review, and competitive quote within 24 hours.
Materials :
The Shengyi SH260 is a mid-loss to low-loss high-speed laminate engineered by Shengyi Technology for 112Gbps and 224Gbps PAM4 high-speed digital systems as well as AI computing platforms. According to the Shengyi SH260 datasheet PDF, the material delivers a dissipation factor (Df) of ≤ 0.005 at 10GHz and a dielectric constant (Dk) of approximately 3.6 ± 0.05, positioning it as a premier solution for next-generation high-frequency signal integrity applications.
Manufacturing with SH260 introduces several formidable process challenges that distinguish elite fabricators from conventional PCB houses. The resin system exhibits low fluidity and a narrow lamination parameter window, requiring precision-controlled press cycles. The Z-axis coefficient of thermal expansion (CTE) must be tightly managed to prevent BGA solder joint cracking during thermal cycling. Drilling, browning, lamination, and desmearing operations demand cleanliness standards three to five times more stringent than conventional FR4 processing. Additionally, signal loss tolerance is exceptionally tight, with impedance control typically maintained within ±5% in a domain where many fabricators accept ±10%.
When conducting a comparative evaluation of Shengyi SH260 vs standard FR4, the differences become stark. SH260 vs S1000 and SH260 vs S1141 comparisons reveal that S1000 and S1141 are general-purpose FR4 materials with Df values typically exceeding 0.020, while SH260's ultra-low loss characteristics enable 112Gbps PAM4 channel performance that conventional FR4 cannot support. For designers seeking a Shengyi SH260 equivalent in alternative supply chains, materials such as TU-872, EM-370Z, and S7040G occupy similar performance tiers, though SH260 remains the reference standard for many AI and hyperscale data center designs.
The SH260 thermal properties include a high Tg value exceeding 150°C (as confirmed in the SH260 Tg value specification), ensuring robust performance under lead-free reflow profiles and extended operational lifetimes. The Shengyi SH260 mechanical properties encompass excellent peel strength, low z-axis CTE, and superior CAF resistance, while Shengyi SH260 thickness options typically range from 0.05mm to 0.76mm core constructions, providing design flexibility for hybrid stack-ups.
Any factory producing SH260 PCBs must therefore demonstrate triple-layered mastery: high-frequency and high-speed materials expertise, high-multilayer fabrication capability, and high-density interconnect (HDI) proficiency.
Minkinzi recommends establishing a dedicated Industry Experience and High-End Case Studies landing page featuring anonymized physical images for each domain, while respecting client confidentiality agreements.
Typical products include AI accelerator cards such as OAM and UBB modules, GPU computing boards, and switch ASIC core boards. Board structures range from 20L to 30L with stacked configurations incorporating three to four SH260 core boards. Key parameters include 2.5/2.5mil line width and spacing, ±5% impedance tolerance, and back-drilling stub lengths of ≤ 0.2mm. Application keywords for this segment include AI server PCB, HPC motherboard, and OAM accelerator.
Typical products include 800G OSFP and QSFP-DD optical modules alongside 51.2T switch motherboards. Board structures range from 16L to 24L and incorporate mSAP process flows. The critical parameters supporting 112Gbps PAM4 channels include back-drilling accuracy of ±2mil and insertion loss budgets below 0.5dB per inch. The favorable Shengyi SH260 dielectric constant stability across frequency and temperature makes this material ideal for these demanding applications. Keywords include 800G optical module PCB, data center switch PCB, and 112Gbps PCB.
Typical products include AAU base station RF units, DU/CU digital processing boards, and millimeter-wave small base stations. Board structures range from 12L to 20L with high-frequency mixed voltage stack-ups. The combination of SH260 with RO4350B and RO4450F mixed dielectrics, along with PPO and PPE resin system compatibility, enables exceptional RF performance. The SH260 thermal properties ensure stable operation across the wide temperature ranges experienced in outdoor telecom installations. Keywords include 5G base station PCB, mmWave PCB, and telecom infrastructure.
Typical products include autonomous driving domain control motherboards, LiDAR PCBs, and 4D imaging millimeter-wave radar boards. Board structures range from 8L to 16L and comply with IATF 16949 quality system requirements. Core parameters include AEC-Q100 and Q104 compatibility with CAF anti-ion migration performance exceeding 1000 hours. The Shengyi SH260 mechanical properties provide the vibration and thermal shock resilience required for automotive qualification. Keywords include ADAS PCB, autonomous driving controller, and automotive radar PCB.
Typical products include spaceborne communication boards, phased array radar T/R modules, and low-orbit satellite payload boards. Board structures range from 12L to 22L and incorporate aerospace-grade materials including SH260 with polyimide. Core parameters include vacuum release TML below 1%, strict CTE matching, and aerospace-grade conformal coating. The Shengyi SH260 datasheet PDF documents the outgassing characteristics that make this material suitable for space-grade applications. Keywords include satellite PCB, phased array radar, and aerospace PCB.
Typical products include CT and MRI motherboards, ultrasound probe PCBs, and endoscope image processing boards. Board structures range from 10L to 18L. Core parameters emphasize low-noise signal integrity, long-term reliability, and ISO 13485 medical device quality system compliance. The stable Shengyi SH260 dielectric constant across the frequency spectrum ensures accurate signal acquisition in diagnostic imaging equipment. Keywords include medical imaging PCB, CT scanner PCB, and ultrasound probe.
Typical products include server power modules compliant with 80Plus Titanium standards, industrial PLCs, and UPS main control boards. Board structures range from 4L to 12L with thick copper and high-speed mixed voltage configurations. Core parameters include 6oz thick copper combined with SH260 signal layers achieving insulation withstand voltage of ≥ 5kV. The Shengyi SH260 thickness options available in various core constructions enable designers to optimize these hybrid power-and-signal stack-ups. Keywords include industrial control PCB, server power PCB, and thick copper PCB.
Typical products include oscilloscope mainboards, vector network analyzers, and ATE test fixture boards. Board structures range from 12L to 20L. Core parameters emphasize signal sampling accuracy, extremely low crosstalk, and shielding integrity. The Shengyi SH260 equivalent materials in our approved supply chain provide design flexibility for test and measurement applications. Keywords include test and measurement PCB and oscilloscope mainboard.
Beyond the high-end applications detailed above, Minkinzi's manufacturing capabilities extend across the full spectrum of electronics industry segments.
Our PCB solutions power the devices that define modern connected life. Smartphones rely on our high-density main boards and RF modules, while tablet computers utilize our compact motherboard designs. Laptop computers benefit from our mainboard and sub-board assemblies with optimized thermal management. Smart TVs incorporate our display driver boards, and set-top boxes leverage our main processing board layouts. Game consoles depend on our main and controller board designs for immersive experiences. Wireless earphones utilize our miniaturized charging case PCBs, while smart watches feature our compact mainboards. Digital cameras employ our main and image processing boards, and Bluetooth speakers integrate our audio control PCBs with precise signal routing.
Desktop computers rely on our high-performance motherboards, while printers utilize our logic control boards for reliable operation. Scanners benefit from our image sensor boards with precision analog signal paths. Wireless routers integrate our main and antenna PCBs for optimal RF performance, and power banks employ our charging management PCBs with advanced battery protection circuitry.
Air conditioners utilize our control boards for variable-speed compressor management, while refrigerators integrate our display and control PCBs for user interface and temperature regulation. Washing machines employ our main control boards for motor and cycle management, and microwave ovens benefit from our control and display PCB assemblies. LED lighting fixtures incorporate our efficient driver boards for long-lasting illumination.
Network switches rely on our high-speed backplane PCBs, while optical fiber modems (ONT/ONU) utilize our mainboard designs. Cordless telephones employ our main control boards for reliable voice communication.
In-vehicle infotainment systems utilize our high-performance mainboards, while body control modules (BCM) integrate our automotive control units with robust environmental tolerance. Car navigation systems benefit from our display driver boards with enhanced EMI performance.
Industrial PLC controllers rely on our logic boards with extended temperature range capability. Solar inverters utilize our power conversion PCBs with high-efficiency thermal management, and uninterruptible power supplies (UPS) employ our main control boards for mission-critical power continuity.
To establish EEAT (Experience, Expertise, Authority, and Credibility) recognition for Google quality ratings, Minkinzi transparently discloses the following key performance indicators. The Shengyi SH260 datasheet PDF combined with our fabrication capabilities confirms our readiness for the most demanding applications.
The robust SH260 thermal properties documented in manufacturer specifications, combined with our precision lamination control, ensure that every PCB leaving our facility meets the most stringent reliability requirements. Whether your design requires the verified performance of authentic SH260 or a qualified Shengyi SH260 equivalent from our approved material library, Minkinzi delivers consistent quality backed by comprehensive certifications.
Our engineers maintain detailed Shengyi SH260 thickness options documentation and stack-up guidance, enabling rapid prototyping and seamless transition from SH260 vs S1000 or SH260 vs S1141 design decisions into high-yield manufacturing. The Shengyi SH260 mechanical properties are validated through cross-section analysis, thermal stress testing, and long-term reliability monitoring on every production lot.
When your design demands the signal integrity, thermal reliability, and manufacturing precision that 112Gbps and 224Gbps systems require, choose a fabrication partner with proven Shengyi SH260 expertise. Minkinzi combines advanced material knowledge, state-of-the-art equipment, and rigorous quality systems to deliver PCBs that exceed the expectations of AI computing, hyperscale data center, 5G/6G infrastructure, automotive ADAS, aerospace, medical imaging, and high-end industrial applications.
Welcome to contact Minkinzi factory to manufacture Shengyi SH260 PCBs. Email: sales@minkinzi.com
Materials :
Minkinzi Factory specializes in manufacturing premium Shengyi SH260 high quality PCB laminate products for advanced electronics including 25–50 Gbps high-speed backplanes, AI accelerator cards, 800G optical modules (QSFP-DD/OSFP), switches, servers, and next-generation computing platforms. As a Shengyi SH260 reliable supplier with 200+ CCL materials in stock, we deliver precision-engineered multilayer solutions from 4 layers to 100 layers — backed by certified quality, SH260 global shipping available worldwide, and unmatched technical expertise.
The Shengyi SH260 is a medium-loss prepreg and copper-clad laminate system with Df ≈ 0.008 at 10 GHz and Dk ≈ 3.5, designed specifically for high-speed digital and high-frequency hybrid stack-ups. Within a production PCB stack-up, SH260 is typically combined with conventional FR-4, low-loss CCL, ultra-low-loss CCL, semi-flexible/flexible PCB PI dielectric, and PTFE high-frequency dielectric layers. Maintaining a dual inventory of "main materials + supporting materials" is the industry standard at the factory level for any Shengyi SH260 high quality PCB laminate program, ensuring reliable sourcing for prototypes, NPI, and mass production alike.
Below is the comprehensive reference table of standard carrier materials used in SH260 stack-ups as "non-signal layers", "power planes", "ground planes", and "identification layers". Our inventory readily supports Shengyi SH260 1.0mm PCB core combinations as well as Shengyi SH260 1.6mm thickness, Shengyi SH260 0.8mm laminate, and Shengyi SH260 2.0mm board configurations paired with these substrates.
These substrates form the carrier layers that complement SH260 in your stack-up. The most popular standard cores for server boards and AI accelerator cards — S1141, S1000H, S2150, 370HR, and KB-6167C — are typically stocked in standard thicknesses including 0.10, 0.20, 0.36, 0.71, 1.0, 1.2, 1.55, and 2.0 mm, and are available with matching prepreg sheets 1080, 2113, 2116, and 7628. For programs that specify Shengyi SH260 1.6mm thickness or Shengyi SH260 2.0mm board as the main signal layers, these supporting cores provide stable mechanical reinforcement, controlled Z-CTE, and reliable lamination behavior.
The following table catalogs our specialty inventory for high-speed signal layers, RF/high-frequency layers, IC substrate carriers, and rigid-flex build-ups. Every Shengyi SH260 high quality PCB laminate project at Minkinzi benefits from in-stock availability and Shengyi SH260 fast delivery.
Due to space considerations, the following catalogs have not been fully expanded here: Hitachi Chemical (MCL-432/433/437/770, E-705G/E-708G, LZ series), Resonac, DuPont Pyralux (PI Flexible Circuit Board Series AC/AX/PC/LF/TK), 3M, CEM series, and Cycloaliphatic resins. A complete second-level material list for "flexible PCBs + rigid-flex PCBs + IC substrates" can be supplied upon request through our Shengyi SH260 technical support team.
Minkinzi High-End PCB Manufacturing · Leading Supplier of High-Speed / High-Frequency / High-Multilayer PCBs
Targeting the AI computing power, 800G optical modules, satellite communications, radar, and high-end server markets, we provide high-end PCB manufacturing services from 4 layers to 100 layers. Our factory maintains a stock of 200+ materials, including SH260, S7439, RO4350B, BT substrates, PTFE, and rigid-flex PCB systems. Shengyi SH260 fast delivery for standard specifications is 5–10 days, while special materials are fulfilled in 2–4 weeks. SH260 global shipping available with dedicated logistics to Southeast Asia, India, Malaysia, Singapore, Indonesia, Vietnam, Thailand, the UK, the USA, the Netherlands, Spain, and beyond. Request a SH260 PCB free sample today to evaluate our quality firsthand.
Ultra-high layer count: Single board up to 100 layers, supported by 50,000-meter lamination capacity and ultra-long vacuum press systems
High-speed materials: SH260, S7045G, S7439, and the SCGA series — full system core materials held in stock, including Shengyi SH260 0.8mm laminate and Shengyi SH260 1.0mm PCB core configurations
High-frequency systems: Rogers, Taconic, Mitsubishi, and PTFE series alongside Shengyi SF series — 60+ types in total
Rigid-Flex boards: Pyralux plus SI system builds, 4–24 layers with arbitrary interconnection
IC carriers / Embedded components: BT resin (GH950/957) plus SL-P series substrates
Special processes: HDI Anylayer, mSAP / Modified Semi-Additive Process, 22 µm / 35 µm ultra-thin copper, 42 µm / 50 µm high-speed microstrip lines, back drilling, controlled-depth drilling, and plating & filling
Certification systems: ISO 9001, IATF 16949, AS9100, UL, RoHS, and REACH
As a Shengyi SH260 reliable supplier with vertically integrated manufacturing, we control every step from CCL sourcing, lamination, drilling, plating, and imaging to final electrical test. Our engineering team provides Shengyi SH260 technical support covering stack-up simulation, impedance modeling, material selection, and Df/Dk verification for 25–112 Gbps channels. Whether you need Shengyi SH260 1.6mm thickness for backplane sub-cards, Shengyi SH260 2.0mm board for high-multilayer server switches, or a thinner Shengyi SH260 0.8mm laminate for compact AI accelerator mezzanines, we deliver consistent quality across every batch. SH260 global shipping available with DDP, FOB, and EXW terms to suit your procurement workflow. Order a SH260 PCB free sample and experience the difference of working with a high-end specialist.
Whether you are developing the next-generation AI server platform, an 800G optical module reference design, a 5G millimeter-wave antenna, or a defense/aerospace radar PCB, Minkinzi Factory delivers the speed, material depth, and engineering rigor your program demands.
Contact us now for a SH260 PCB free sample, technical datasheet, quotation, and stack-up consultation.
Email: sales@minkinzi.comWebsite: Minkinzi Factory — Your Global Partner for Shengyi SH260 high quality PCB laminate, fast delivery, full certification, and 200+ materials in stock.
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Address 1:Songshan Lake International Creativity Design Industry Park,No. 10, West Industrial Road,Songshan Lake High-Tech Dist.,Dongguan,China.523808. Address 2:No. 18, Zhenyuan East Road, Chang 'an Town, Dongguan City, Guangdong Province.523000.
