Dear Partners, welcome to MINKINZI – China’s Trusted End-to-End Manufacturing Partner, with 20 years of expertise, we specialize in: Design & Development → PCB Fabrication → PCBA Assembly → Box-Build Assembly. ODM/OEM/Contract Manufacturing tailored to global standards. Support DFM. .
Rigid PCB
| Layers | 1-58 | |
| Technology | Blind and Buried Via, HDI,Hollow out, Selective Hard gold plating,Depth Control,Press fit hole, Edge Half-plated hole, Back drill, Countersink hole, Plated edge, Peelable solder mask, Imedance control, Gold Finger, Fill via with resin and other technology. | |
| Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
| Max. PCB Panel Size | 9000mmx820mm | |
| Board Thickness | 0.2-12mm | |
| Board Thickness Tolerance | ±10% | |
| Copper thickness | 0.5 OZ to 22 OZ | |
| copper thickness in hole | copper thickness in hole: >25.0 um(>1mil) | |
| Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
| Outer Layers:≧3.5/3.5mil | ||
| For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
| Resin plugged board thickness | 0.3-8mm | |
| Resin plugged maximum aspect ratio | 40:1 | |
| Resin plugged minimum hole to hole space(mm) | 0.65mm | |
| For HDI | Min. mechanical drilling hole diameter | 0.15mm |
| Min. laser drilling hole diameter | 0.075mm | |
| Max. aspect(micro-via) | 1:1 | |
| Max. dielectric thickness for laser drill | 0.05-0.15mm | |
| Bottom pad size(under micro-via) | Hole Size+0.17mm | |
| Top side pad size(on micro-via) | Hole Size+0.15mm | |
| Copper filling | Y | |
| Via in pad design | Y | |
| Buried hole resin plugged | Y | |
| Min. via size can be copper filled | 0.075mm | |
| Min plated hole size | 20um(0.8mil) | |
| Min Blind/Buried hole size | 0.2mm(8mil) | |
| Min Annular Ring | ±0.076mm(±3mil) | |
| Min width of cutout (NPTH) | 0.8mm | |
| Min width of slot hole (PTH) | 0.6mm | |
| Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green,matt black | |
| Silkscreen color | White, Yellow, Red, Black | |
| Surface finish | ENIG, ENEPIG,Immersion Tin, HASL, HASL-LF, OSP,Selective OSP, Gold finger, Immersion Silver,Bare Copper,Hard gold plating, Selective hard gold plating,Selective Immersion gold,Selective gold plating,HASL-LF+Selective Immersion gold,HASL-LF+Selective gold plating,HASL-LF+OSP,and other surface treatments. | |
| Outline | Routing, V-cut, Bridge, Stamp hole | |
| Outline Tolerance | ±0.15mm (±6mil) | |
| Hole Tolerance | PTH +/-3mil | |
| NPTH +/-2mil | ||
| Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
| E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
| Min spacing from test pad to board edge:0.5mm | ||
| Min conductive resistance:5Ω | ||
| Max insulation resistance:250mΩ | ||
| Max test voltage:500V | ||
| Min test pad diameter:6mil | ||
| Min test pad to pad spacing:10mil | ||
| Max test pad to pad spacing:10mil | ||
| Max test current:200MA | ||
| AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
| Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" | ||
| Profiling | Punching,Routing, V-CUT,Beveling | |
Rigid Flexible PCB, Flexible PCB
| Layers | 1-56(for rigid-flex circuits);1-10(for flex circuits) | |
| Base Materials | Kapton, Polyimide, PET,FR4(for rigid part),Customer requested,any other materials, customer can confirm with us. | |
| Stiffener Materials | Polyimide, PET, FR4, SUS,Customer requested | |
| Max board size | 3000mm*520mm | |
| Min. Buried Via/PAD | 0.4mm/1.0mm | |
| Min. Distance from Via to Line | 0.3mm | |
| Min.Track Width/Space | 0.051mm/0.051mm | |
| Min hole-drilling size | 0.2mm | |
| Min hole-punching size | 0.5mm | |
| Aspect Ratio | 20:1 | |
| Base Copper | 1/4Oz--13Oz | |
| Surface Treatment | ENIG: 0.025um - 3um;Immersion Tin: 0.04-1.5um;OSP,any other surface treatment, customer can confirm with us. | |
| Min pad | 5mil(0.13mm) | |
| Min finished hole size | 0.15mm | |
| Outline Tolerance | ±0.05mm | |
| Hole Registration | ±0.05mm | |
| Conductor to Outline tolerance | ±0.1mm | |
| Conductor Width tolerance | ±10% | |
| Hole wall thickness | 10-50um | |
| Max hole-plugging size | 0.7mil | |
| Solder mask tolerance | 50+/-10%, 75+/-10%, 100+/-10% | |
| Peel strenth | 1.0kgf/cm(IPC-TM-650) | |
| Solder Float | 288℃/10s(IPC Standard) | |
| Flammability | 94V-O(UL94) | |
Metal Core Circuits(MPCB)
| Layers | ≦4 | |
| Metal | Aluminum, Copper | |
| Supplier for laminate | Berquist, Thermogan, Totking, Polytronics, Eastpower, Chengyue CCAF etc. | |
| Finish board thickness | 0.2~5.0mm | |
| Copper thickness | ≦3oz | |
| Supplier for solder mask | Taiyo, Fotochem etc. | |
| Surface finish | Electrolytic silver, ENIG, Immersion tin, Immersion silver, OSP, Lead Free HASL etc. | |
| Type of finished outline | Routing, punching, V-cut | |
| Min trace width/spacing: | 0.25/0.25mm | |
| Bow and twist | ≤0.75% | |
| Min hole's size | 1.0mm | |
| Thermal resistance (℃/W) | 1.0, 0.4 | |
| Thermal-conductive (W/m·k) | 1.0, 2.5 | |
PCBA Capability
| Max. PCBA Size | 9000mm x820mm | |
| Min BGA and Micro BGA pitch and ball counts | 0.008"(0.2mm) pitch, ball count greater than 1000 | |
| BGA Package | 0.3mm min | |
| BGA Ball Pitch | 0.15mm (Min) | |
| Chip Component | 01005-2512 | |
| QFN(DQFN/AQFN) LGA Package Pitch | 0.3mm min | |
| Through-hole reflux process | yes | |
| Testing | X-Ray,AOI, SPI, LCR,Microscope to 20x, ICT, Function test, Temperature cycling. | |
| PCBA Type | Flex pcb, Rigid Flex PCB, Rigid PCB, Metal core PCB, Ceramic PCB. | |
| Therminal Crimping Process | Yes | |
| Non-Standard Components | Support | |
| Conformal Coating, Glue,Cabel Assembly | Support | |
| All smt machines connected to MES System | Yes | |
| Smart Electronic component wearhouse | Yes | |
| Box Build | Yes | |
| From bare pcb to final whole product manufacturing | Yes | |
| IC Programming | Yes | |
| Do Functional Test | Yes | |
| About other information | Please contact us to know. | |
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Telephone: +86 0769 3320 0710
Cel/What's app: +86 134 6956 5519
Address 1:Songshan Lake International Creativity Design Industry Park,No. 10, West Industrial Road,Songshan Lake High-Tech Dist.,Dongguan,China.523808. Address 2:No. 18, Zhenyuan East Road, Chang 'an Town, Dongguan City, Guangdong Province.523000.
