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Description :
FPC (Flexible printed circuits) are made with a photolithographic technology. An alternative way of making flexible foil circuits or flexible flat cables (FFCs) is laminating very thin (0.07 mm) copper strips in between two layers of PET. These PET layers, typically 0.05 mm thick, are coated with an adhesive which is thermosetting, and will be activated during the lamination process. FPCs and FFCs have several advantages in many applications:
· Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static application).
· Electrical connections where the assembly is required to flex during its normal use, such as folding cell phones (dynamic application).
· Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars, rockets and satellites.
· Electrical connections where board thickness or space constraints are driving factors.
Applications :
Flex circuits are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. A common application of flex circuits is in computer keyboards; most keyboards use flex circuits for the switch matrix.
Organic light-emitting diodes (OLEDs) are normally used instead of a back-light for flexible displays, making a flexible organic light-emitting diode display.
Most flexible circuits are passive wiring structures that are used to interconnect electronic components such as integrated circuits, resistors, capacitors and the like, however some are used only for making interconnections between other electronic assemblies either directly or by means of connectors.
In the automotive field, flexible circuits are used in instrument panels, under-hood controls, circuits to be concealed within the headliner of the cabin, and in ABS systems. In computer peripherals flexible circuits are used on the moving print head of printers, and to connect signals to the moving arm carrying the read/write heads of disk drives. Consumer electronics devices make use of flexible circuits in cameras, personal entertainment devices, calculators, or exercise monitors.
Flexible circuits are found in industrial and medical devices where many interconnections are required in a compact package. Cellular telephones are another widespread example of flexible circuits.
Flexible solar cells have been developed for powering satellites. These cells are lightweight, can be rolled up for launch, and are easily deployable, making them a good match for the application. They can also be sewn into backpacks or outerwear.
Flow Chart :
Single-sided flex circuits
Single-sided flexible circuits have a single conductor layer made of either a metal or conductive (metal filled) polymer on a flexible dielectric film. Component termination features are accessible only from one side. Holes may be formed in the base film to allow component leads to pass through for interconnection, normally by soldering. Single sided flex circuits can be fabricated with or without such protective coatings as cover layers or cover coats, however the use of a protective coating over circuits is the most common practice. The development of surface mounted devices on sputtered conductive films has enabled the production of transparent LED Films, which is used in LED Glass but also in flexible automotive lighting composites.
Double access or back bared flex circuits
Double access flex, also known as back bared flex, are flexible circuits having a single conductor layer but which is processed so as to allow access to selected features of the conductor pattern from both sides. While this type of circuit has certain benefits, the specialized processing requirements for accessing the features limits its use.
Sculptured flex circuits
Sculptured flex circuits are a novel subset of normal flexible circuit structures. The manufacturing process involves a special flex circuit multi-step etching method which yields a flexible circuit having finished copper conductors wherein the thickness of the conductor differs at various places along their length.
Double-sided flex circuits
Double-sided flex circuits are flex circuits having two conductor layers. These flex circuits can be fabricated with or without plated through holes, though the plated through hole variation is much more common. When constructed without plated through holes and connection features are accessed from one side only, the circuit is defined as a "Type V " according to military specifications. It is not a common practice but it is an option. Because of the plated through hole, terminations for electronic components are provided for on both sides of the circuit, thus allowing components to be placed on either side. Depending on design requirements, double-sided flex circuits can be fabricated with protective coverlayers on one, both or neither side of the completed circuit but are most commonly produced with the protective layer on both sides. One major advantage of this type of substrate is that it allows crossover connections to be made very easy. Many single sided circuits are built on a double sided substrate just because they have one of two crossover connections. An example of this use is the circuit connecting a mousepad to the motherboard of a laptop. All connections on that circuit are located on only one side of the substrate, except a very small crossover connection which uses the second side of the substrate.
Multilayer flex circuits
Flex circuits having three or more layers of conductors are known as multilayer flex circuits. Commonly the layers are interconnected by means of plated through holes, though this is not a requirement of the definition for it is possible to provide openings to access lower circuit level features. The layers of the multilayer flex circuit may or may not be continuously laminated together throughout the construction with the obvious exception of the areas occupied by plated through-holes. The practice of discontinuous lamination is common in cases where maximum flexibility is required. This is accomplished by leaving unbonded the areas where flexing or bending is to occur.
Capability :
| Flexible PCB Capability | ||
| Layers | ≦30 Layer | |
| Base Materials | Kapton, Polyimide, PET,Customer requested | |
| Stiffener Materials | Polyimide, PET, FR4, SUS,Customer requested | |
| Max board size | 500*1100mm(for flex circuits) | |
| Min.Track Width/Space | 0.051mm/0.051mm | |
| Min hole-drilling size | 0.2mm | |
| Min hole-punching size | 0.5mm | |
| Aspect Ratio | 6:1 | |
| Base Copper | 1/4Oz--3Oz | |
| Surface Treatment | ENIG: 0.025um - 3um;Immersion Tin: 0.04-1.5um;OSP | |
| Min pad | 5mil(0.13mm) | |
| Min finished hole size | 0.15mm | |
| Outline Tolerance | ±0.075mm | |
| Hole Registration | ±0.050mm | |
| Conductor Width tolerance | ±10% | |
| Hole wall thickness | 10-50um | |
| Max hole-plugging size | 0.7mil | |
| Solder mask tolerance | 50+/-10%, 75+/-10%, 100+/-10% | |
| Peel strenth | 1.0kgf/cm(IPC-TM-650) | |
| Solder Float | 288℃/10s(IPC Standard) | |
| Flammability | 94V-O(UL94) | |
Materials :
Base material
The base material is the flexible polymer film which provides the foundation for the laminate. Under normal circumstances, the flex circuit base material provides most primary physical and electrical properties of the flexible circuit. In the case of adhesiveless circuit constructions, the base material provides all of the characteristic properties. While a wide range of thickness is possible, most flexible films are provided in a narrow range of relatively thin dimension from 12 µm to 125 µm (1/2 mil to 5 mils) but thinner and thicker material are possible. Thinner materials are of course more flexible and for most material, stiffness increase is proportional to the cube of thickness. Thus for example, means that if the thickness is doubled, the material becomes eight times stiffer and will only deflect 1/8 as much under the same load. There are a number of different materials used as base films including: polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), polyetherimide (PEI), along with various fluropolymers (FEP) and copolymers. Polyimide films are most prevalent owing to their blend of advantageous electrical, mechanical, chemical and thermal properties.
Bonding adhesive
Adhesives are used as the bonding medium for creating a laminate. When it comes to temperature resistance, the adhesive is typically the performance limiting element of a laminate especially when polyimide is the base material. Because of the earlier difficulties associated with polyimide adhesives, many polyimide flex circuits presently employ adhesive systems of different polymer families. However some newer thermoplastic polyimide adhesives are making important in-roads. As with the base films, adhesives come in different thickness. Thickness selection is typically a function of the application. For example, different adhesive thickness is commonly used in the creation of cover layers in order to meet the fill demands of different copper foil thickness which may be encountered.
Metal foil
A metal foil is most commonly used as the conductive element of a flexible laminate. The metal foil is the material from which the circuit paths are normally etched. A wide variety of metal foils of varying thickness are available from which to choose and create a flex circuit, however copper foils, serve the vast majority of all flexible circuit applications. Copper’s excellent balance of cost and physical and electrical performance attributes make it an excellent choice. There are actually many different types of copper foil. The IPC identifies eight different types of copper foil for printed circuits divided into two much broader categories, electrodeposited and wrought, each having four sub-types.) As a result, there are a number of different types of copper foil available for flex circuit applications to serve the varied purposes of different end products. With most copper foil, a thin surface treatment is commonly applied to one side of the foil to improve its adhesion to the base film. Copper foils are of two basic types: wrought (rolled) and electrodeposited and their properties are quite different. Rolled and annealed foils are the most common choice, however thinner films which are electroplated are becoming increasingly popular.
In certain non standard cases, the circuit manufacturer may be called upon to create a specialty laminate by using a specified alternative metal foil, such as a special copper alloy or other metal foil in the construction. This is accomplished by laminating the foil to a base film with or without an adhesive depending on the nature and properties of the base film.
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