Dear Partners, welcome to MINKINZI – China’s Trusted End-to-End Manufacturing Partner, with 20 years of expertise, we specialize in: Design & Development → PCB Fabrication → PCBA Assembly → Box-Build Assembly. ODM/OEM/Contract Manufacturing tailored to global standards. Support DFM. .
Precision PCB/PCBA Solutions for Critical Defense Systems
◆ Military-Grade Reliability
Engineered for extreme environments with IPC Class 3/AS9100D compliance. Ruggedized designs withstand shock, vibration & thermal stress in aerospace/defense applications.
◆ Mission-Certified Manufacturing
ITAR-controlled facilities deliver encrypted communication PCBA, drone avionics, and radar system circuits. Full traceability from prototyping to bulk production.
◆ High-Density Integration
Advanced HDI & multilayer PCB capabilities (up to 56 layers) . Optimized for AI server boards, sensor arrays, and military IoT systems with EMI/RFI shielding.
◆ Rapid Defense Prototyping
15-day turnaround for urgent projects. DFM analysis and signal integrity testing ensure first-pass success in life-critical deployments.
◆ Secure Supply Chain
NADCAP-accredited material sourcing. End-to-end cybersecurity protocols for confidential projects (NATO/DoD standards).
◆ Request Custom Quote
Upload design files for instant manufacturability review. Export-controlled data handled via AES-256 encryption.
Description :

Military & Aerospace Electronics Manufacturing: FPC/PCB/Rigid-Flex Innovations & Solutions
I. Mission-Critical Applications in Defense & Aerospace
1. Flexible PCBs (FPCs)
Core Applications: Satellite deployable mechanisms • Avionics wiring harnesses (e.g., F-35) • Soldier-worn systems
Performance Advantages:
✓ 15-30% weight reduction vs. traditional wiring
✓ 200K+ bend cycles reliability (MIL-STD-810H verified)
✓ 3D routing in confined spaces (e.g., foldable radar arrays)
2. Rigid PCBs
High-Impact Use Cases: Rocket flight controllers • Phased-array radar PCBs • Ground station servers
Key Strengths:
✓ 0.2dB/inch signal loss at 40GHz (RO4835™ substrates)
✓ 20kg/cm² component load capacity
✓ Space-grade thermal stability (-55°C to +150°C)
3. Rigid-Flex PCBs
Transformative Applications:
» Hypersonic missile guidance systems
» LEO satellite payload modules
» Next-gen fighter flight computers
Breakthrough Benefits:
✓ 30% system weight reduction + 40% reliability increase
✓ Eliminates 90% of connector failure points
4. High-Reliability PCBA
Assembly Excellence:
► Military-grade component integration (QPL-certified)
► 5μm SMT placement accuracy (laser-aligned)
► MIL-IPC-610 Class 3+ compliance
II. Defense-to-Commercial Technology Transfer
| Military Origin | Commercial Product | Real-World Impact |
|---|---|---|
| Satellite FPC Tech | Foldable smartphones | Huawei/Xiaomi hinge PCBs (500K+ cycles) |
| EMI-shielding PCBs | EV battery controllers | Tesla Cybertruck 800V BMS systems |
| Rad-hardened sensors | Medical imaging equipment | Siemens 0.5mm resolution CT scanners |
| Thermal coatings | High-end cookware | Teflon™ reinforced nano-coatings |
III. Aerospace Manufacturing Requirements
Certification Mandates
◉ AS9100D + NADCAP accredited
◉ MIL-STD-461G EMI/EMC compliance
◉ DO-160G environmental testing
Advanced Process Capabilities
▸ Material Science: Polyimide (UPILEX®) / Rogers RO4000® series
▸ Plating: 25-30μm via walls (pulse electroplating)
▸ QC: 100% AOI/X-ray + <30 ppm defect rate
Supply Chain Resilience
★ 85%+ domestic material sourcing (US/EU/Allied)
★ 99.2% on-time delivery (JDB case study validated)
Extreme Environment Validation
» 10⁻⁶ Torr thermal vacuum testing
» 2000Hz random vibration profiling
» MTBF >100,000 hours (accelerated life testing)
IV. Next-Gen Manufacturing Roadmap
Cutting-Edge Technologies
3D additive PCB printing: Curved conformal circuits for drone swarms
AI-optimized routing: 25% crosstalk reduction in radar PCBs
GaN-on-PCB integration: 100W+ RF power amplifiers
Domestic Supply Chain Security
› Chinese ceramic substrates replacing Al₂O₃ imports
› HDI tech: 50μm line/space mass production
Sustainable Manufacturing
♻ Halogen-free laminates (e.g., Isola™ Astra)
♻ Pb-free soldering meeting ESGS-100 standards
Why Partner With Certified PCB Manufacturers?
25+ years of MIL-SPEC production expertise
AS9100 + ITAR compliant facilities
Class 1000 cleanrooms for space PCBA
Contact our aerospace solutions team for:
✓ Free DFM analysis of your mission-critical designs
✓ Rapid prototyping in 72 hours
✓ Supply chain de-risking strategies
Applications :

Strategic Role of Military PCBs & PCBAs: A Global Supply Chain Perspective
In the rapidly evolving landscape of modern warfare, Printed Circuit Boards (PCBs) and Printed Circuit Board Assemblies (PCBAs) have emerged as mission-critical components at the heart of advanced defense systems. From precision-guided missiles to satellite communications and electronic warfare platforms, military-grade PCB/PCBA technology underpins the reliability, survivability, and intelligence of next-generation armed forces.
With global militaries accelerating their transition toward electronization, network-centric operations, and AI-driven combat systems, the demand for ultra-reliable, secure, and environmentally resilient electronic hardware has never been higher.
This comprehensive analysis explores the strategic importance of military PCBs and PCBAs, covering key application domains, technical specifications, regional manufacturing trends, supplier selection criteria, and future outlook—with insights from leading multinational manufacturers such as Minkinzi, which are redefining global defense electronics production.
PCBs serve as the "nervous system" of all high-tech military equipment. They enable signal processing, power distribution, sensor fusion, encrypted communication, and real-time control across five critical operational domains: land, sea, air, space, and cyber.
Below are 25+ high-impact military electronic product types where advanced PCB/PCBA design is non-negotiable:
| # | Product Type | Subsystem | Key PCB/PCBA Requirements |
|---|---|---|---|
| 1 | Active Electronically Scanned Array (AESA) Radar | Radar Systems | Multilayer RF boards, millimeter-wave integration, thermal management |
| 2 | Missile Seeker (Radar/IR Composite) | Weapon Guidance | HDI, microvias, shock-resistant materials |
| 3 | Tactical Data Link Terminal (Link 16) | C4ISR | Wide temperature range (-40°C to +85°C), EMI shielding |
| 4 | Military Satellite Comms (Ka/Ku Band) | Space Systems | Low-loss laminates (Rogers, Teflon), impedance control ±5% |
| 5 | Fighter Jet Avionics CPU | Aviation Electronics | Multi-core processor mounting, redundancy, fault tolerance |
| 6 | UCAV Flight Control System | UAV Platforms | Lightweight flex-rigid designs, strong EMC protection |
| 7 | Tank Fire Control Computer | Ground Combat Systems | Vibration resistance, conformal coating, ruggedized assembly |
| 8 | Encrypted GPS Receiver (M-code) | Navigation | Anti-jamming circuits, secure crypto-chip integration |
| 9 | Electronic Countermeasures (ECM) Jammer | EW Systems | Broadband RF front-end, high-speed ADC/DAC modules |
| 10 | Sonar Signal Processor (Submarine) | Naval Warfare | High SNR analog circuitry, low-noise amplifiers |
| 11 | Laser Rangefinder Controller | Optoelectronics | High-voltage pulse drivers, fast timing circuits |
| 12 | Military Encrypted Router (IPSec/TLS) | Secure Networks | Tamper-proof layout, isolated data paths |
| 13 | Inertial Navigation (INS/GPS Fusion) | Positioning | MEMS interface circuits, low-drift power supplies |
| 14 | Helicopter MFD Display | Cockpit Systems | Real-time OS support, high-brightness LCD drivers |
| 15 | Tactical Radio (PRC-152 Class) | Field Communication | Miniaturized SMT, battery efficiency optimization |
| 16 | Anti-UAV Detection Radar | Emerging Threat Defense | Embedded FPGA processing, compact radar frontend |
| 17 | Vehicle-Mounted Military Server | Edge Computing | Backplane interconnects, heat dissipation design |
| 18 | IR Night Vision Device Control | Reconnaissance | Cold-start performance, low-power imaging logic |
| 19 | EMP Hardening Module | Survivability Enhancement | Shielded layers, transient suppression circuits |
| 20 | UUV Main Control Board | Underwater Drones | Sealed potting, corrosion-resistant substrates |
| 21 | Battlefield Robot Motion Controller | Autonomous Systems | Real-time feedback loops, CAN/FD bus interfaces |
| 22 | DC-DC Power Modules | Energy Distribution | Isolated topologies, wide-input voltage regulation |
| 23 | Tactical Edge AI Inference Engine | Intelligent Warfare | Heterogeneous computing (GPU/NPU on PCB) |
| 24 | Beidou-3 Military Terminal | Domestic Substitution | Short-message service, hardware encryption |
| 25 | Secure Solid-State Storage | Data Logging | Vibration-proof SSD controllers, FIPS-compliant erase |
These applications reflect a shift from basic connectivity to intelligent edge computing, where PCBAs integrate sensors, processors, AI accelerators, and secure communication co-processors into tightly constrained, harsh-environment packages.
Selecting a trusted PCB/PCBA partner is not just about cost—it's about risk mitigation, compliance assurance, and long-term sustainability. Military clients follow strict evaluation frameworks before onboarding suppliers.
Here are six core dimensions used by defense procurement teams worldwide:
Non-negotiable credentials include:
AS9100D / ISO 9001: Aerospace quality management
GJB9001C: Mandatory for Chinese state-owned defense projects
ITAR Registration: Required for handling U.S.-controlled defense tech
NADCAP Accreditation: For special processes (welding, NDT)
State Secrecy Bureau Level 3+ Certification (China)
Lack of any one disqualifies a vendor from bidding on classified programs.
Suppliers must demonstrate proven expertise in:
High-frequency (>10GHz): Rogers/Teflon substrates, tight impedance control
HDI/BGA (0.3mm pitch): Laser drilling, X-ray BGA inspection
≥20-layer boards: Blind/buried vias, lamination stability
Tri-proof coating: Moisture, salt spray, mold resistance via conformal/potted encapsulation
HALT/HASS Testing: Environmental stress screening for life prediction
Defense buyers increasingly prioritize:
Use of non-EAR-controlled ICs (Export Administration Regulations)
Adoption of domestic alternatives (e.g., Loongson CPUs, Phytium chips, Fudan Microelectronics)
Local sourcing of base materials (avoid reliance on Isola, Panasonic, etc.)
Dual-source strategies to prevent single-point failure
Example: Chinese military projects now require ≥70% domestic component substitution.
Critical requirements:
Dedicated classified workshops with access control
On-site audit readiness and data sovereignty guarantees
Air-gapped ERP/MES systems to prevent cyber leakage
Compliance with national secrecy laws (e.g., China’s Classified Information Protection Law)
Flexibility across lifecycle stages:
Prototype turnaround ≤7 days for R&D iterations
Small batch consistency (CPK ≥1.33) post-design freeze
Support for JIT delivery and VMI inventory models
Stable yield in volume runs (≥10k units/month)
For multinational primes:
Local warehousing/distribution in North America, Europe, ASEAN
Multilingual engineering support teams
Cross-time-zone response SLAs (<4-hour initial reply)
Export compliance advisory services
Leading EMS providers like Minkinzi offer “One Interface, Global Delivery” — simplifying logistics for complex international defense contracts.
When choosing where to manufacture military PCBAs, geography matters. Each region offers distinct advantages and trade-offs in cost, capability, compliance, and political risk.
| Dimension | Mainland China | Southeast Asia (Thailand/Malaysia) | USA/Germany/France |
|---|---|---|---|
| Cost Competitiveness | ★★★★★ (Low labor, full ecosystem) | ★★★★☆ (Slightly higher than China) | ★★☆☆☆ (+30–50% vs. Asia) |
| Technology Level | ★★★★☆ (Advanced HDI, RF, SiP) | ★★★☆☆ (Mid-tier capacity) | ★★★★★ (Cutting-edge R&D) |
| Lead Time | Prototype: 5–7d; MP: 15–25d | Prototype: 7–10d; MP: 20–30d | Prototype: 10–14d; MP: 30+d |
| Compliance Risk | Medium-High (US tech restrictions) | Low ("Neutral" export status) | Very Low (Domestic-only rules) |
| Political Stability | Medium (Geopolitical exposure) | Medium-Low (Policy volatility) | High (Stable institutions) |
| Environmental Standards | Upgrading (RoHS Level 2–3) | Generally compliant | Full REACH/RoHS adherence |
| Representative Firms | Shennan Circuits, Jingwang, Chongda | Unimicron (TH), ASE (MY) | Jabil, Flex, Benchmark |
Trend Alert: NATO allies are actively pursuing “de-Sinicization” of sensitive supply chains, shifting production to Southeast Asia or domestic foundries. However, China remains dominant in the Asia-Pacific due to unmatched scale, speed, and vertical integration.
Minkinzi stands out as a pioneering multinational EMS provider serving the global defense industry through a geographically diversified, strategically positioned manufacturing footprint.
| Country | Facility Role | Strategic Advantage | Key Clients |
|---|---|---|---|
| China (Shenzhen) | R&D Hub + High-End PCBA | Deep technical pool, rapid prototyping | PLA-linked institutes, AVIC, CETC |
| Thailand (Bangkok) | ASEAN Regional Center | Tariff benefits, neutral export origin | Mitsubishi Electric, Hanwha Defense |
| Malaysia (Penang) | Semiconductor Co-Packaging | Proximity to Infineon, ON Semi fabs | Thales, Saab, Airbus DS |
| Philippines (Clark) | Labor-Intensive Assembly | Lower costs than China | Tier-2 U.S. subcontractors |
| India (Pune) | Make-in-India Base | Govt incentives, localization push | DRDO joint ventures |
| Indonesia (Batam) | Capacity Expansion Zone | Land availability, logistics access | Regional distributors |
| Singapore | HQ + Tech Incubation | Legal clarity, capital mobility | NATO consortia, venture spin-offs |
Trade Barrier Mitigation: Leverage Thailand/Malaysia factories to bypass U.S. BIS export controls when using restricted technologies.
Hybrid Delivery Network: Combine "China R&D + Southeast Asian Production + EU/US Final Integration" for optimal speed, cost, and compliance.
Localization Compliance: Meet “Buy National” policies (e.g., India’s ‘Atmanirbhar Bharat’) with local factories increasing bid win probability.
Innovation Acceleration: Singapore lab focuses on SiP (System-in-Package) for missile seekers, enabling smaller form factors and higher performance.
✅ This hybrid model enables seamless collaboration between U.S., European, Chinese, and Indo-Pacific defense ecosystems—without violating jurisdictional boundaries.
Developing a military-grade PCBA follows a rigorous V-model process, ensuring traceability, verification, and long-term reliability.
Requirements → Architecture Design → PCB Layout → DFM/DFT Review ↓ ↑ EVT (Engineering Validation Test) Design Iteration ↓ ↑ ESS (Environmental Stress Screen) Reliability Feedback ↓ ↑ DVT (Design Verification) Component Qualification ↓ ↑ PVT (Pilot Run) Process Capability Study ↓ ↑ MIL-STD-810G / DO-160 Testing Failure Mode Analysis ↓ Mass Production (MP) + Spare Parts Planning
Each phase requires close coordination among PCB fabricator, SMT assembler, mechanical engineer, software team, and test lab.
| Project Type | Recommended Partner Mix | Why It Works |
|---|---|---|
| Domestic Substitution | Chinese PCB + Chinese SMT | Full control over IP, fast adaptation to国产 chips |
| Export-Oriented Program | SE Asia PCB + SE Asia SMT | Avoid sanctions, enjoy ASEAN-EU/USFTA tariff breaks |
| High-Frequency Radar Module | EU/US Materials + China SMT | Combine premium laminates with agile rework capability |
| Rapid Prototyping | China Express Fab + Minkinzi Fast Track | Achieve 7-day closed-loop iteration |
| Long-Life Spare Parts | Multi-region backup (CN+TH+DE) | Prevent obsolescence, ensure 15+ year support |
Pro Tip: Engage contract manufacturers early during DFM review to avoid costly redesigns later.
The defense PCB/PCBA landscape is undergoing transformative change driven by technological, geopolitical, and industrial shifts.
Vertical Integration Acceleration
Top-tier players are merging capabilities:
PCB makers acquiring material firms (e.g., Jingwang investing in Shengyi Technology)
SMT factories expanding into chiplet packaging and embedded passives
Smart Factory Transformation
AI-powered innovations now standard:
AI-based AOI inspection reducing false calls by 60%+
Digital twin simulation optimizing yield pre-production
Predictive maintenance minimizing downtime
Green Defense Electronics Movement
Sustainability enters military procurement:
Lead-free soldering (Sn-Ag-Cu) becoming mandatory
Recyclable substrates and biodegradable conformal coatings piloted
Carbon footprint tracking integrated into supplier scorecards
To build resilient, future-ready supply chains, we recommend:
Adopt Multi-Source Supply Chains
Implement AB or ABC sourcing to eliminate single points of failure.
Prioritize Dual-Certified Suppliers
Favor vendors with both GJB9001C and AS9100D—ensuring compatibility across Chinese and Western quality systems.
Engage Early in Design (DFM/DFT)
Invite EMS partners into architecture reviews to reduce rework and accelerate time-to-field.
Watch for Hidden Costs
Low quotes may hide risks: poor after-sales support, delayed deliveries, hidden tariffs, or rework charges.
Leverage Global Platforms Like Minkinzi
Utilize “One Face to Client” global networks that unify engineering, manufacturing, logistics, and compliance.
Today’s battles are won not only on the front lines—but also in cleanrooms, labs, and PCB fabrication facilities. A seemingly small piece of fiberglass and copper can determine whether a missile hits its target, a drone avoids jamming, or a soldier receives encrypted orders in hostile terrain.
As major powers compete for dominance in AI warfare, hypersonics, and quantum sensing, the reliability, security, and sustainability of military PCBAs will define strategic advantage.
Global manufacturing leaders like Minkinzi are no longer just contract assemblers—they are strategic enablers, bridging innovation and deployment across borders, technologies, and doctrines.
Ready to build a secure, scalable, and globally compliant military PCBA supply chain?
Contact us today to explore how our multinational platform can support your next-gen defense program—from concept to continuous sustainment.
Flow Chart :













Military-Grade Electronics Development: End-to-End Process & Strategic Solutions
From Concept to Mass Production with Compliance, Reliability & Supply Chain Security
(Optimized for MIL-SPEC Compliance & Traceability)
| Phase | Key Processes & Standards | Critical Considerations |
|---|---|---|
| Solution Development | Requirements Analysis → Technical Feasibility → EMC/EMI Hardened Design | • Mandatory GJB 9001C Compliance • Class II Confidentiality Protocols (Pre-Contract) |
| Hardware Design | • Redundant Circuit Design & Derating Analysis • HDI PCB Layout (Impedance Control + Thermal Optimization) | • MIL-STD-275 Wiring Standards • HF Interference Mitigation • Metal Core PCBs for Thermal Management |
| Software Development | RTOS (e.g., VxWorks) + MISRA C-Compliant Code | Case: Leike Defense Intelligent Control System (Integrated Air-Space-Ground Platform) |
| PCB Manufacturing | • Materials: Rogers RO4350B (RF), 3oz+ Copper (Power) • 8-16 Layer HDI Standard • 100% Flying Probe + AOI | • IPC-6012 Class 3 Reliability • ITAR-Controlled Facilities |
| Material Selection | Domestic Sourcing Priority / Military Temp Range (-55°C~125°C) | See High-Reliability Component Matrix Below |
| SMT & Assembly | Lead-Free (RoHS) Soldering + X-Ray BGA Inspection | • Class 1000 Cleanroom • ESD S20.20 Protocols |
| Enclosure Production | CNC Machined 6061-T6 Aluminium / Composite Armor + Anodizing | Case: Tactical Mesh Networking Gear (IP67 / MIL-STD-810H) |
| Validation Testing | • Environmental (GJB 150A: Thermal, Vibration, Shock) • EMI/EMC (MIL-STD-461G) • Keysight/Tektronix Tools | • 100% Batch Testing for Mission-Critical Systems |
| Mass Production | • Supply Chain Vetting (ITAR/EEI Compliance) • Full Traceability (UID "One Item, One Code") | • Anti-Counterfeit Material Screening • Closed-Loop Data Management |
Trusted Materials for Critical Defense Applications
| Component Type | Manufacturer/Model | Application Case | Key Advantage |
|---|---|---|---|
| Tantalum Capacitors | AVX TAJ Series | Missile Guidance Power Filters | Stable ESR @ Extreme Vibration |
| Military MLCCs | Hongyuan GRM188R71H103KA01 | Airborne Radar RF Modules | Ultra-Low Df @ High Frequency |
| Carbon Fiber Composites | Zhongjian ZT7 Series | UAV Structural Frames | High Strength-to-Weight Ratio |
| High-Temp Alloys | Fushun Special Steel GH4169 | Jet Engine Turbine Blades | Creep Resistance (800°C+) |
| Mil-Spec Connectors | AVIC Optoelectronics J599 | Armored Vehicle Comms | EMI Shielding + 500+ Mating Cycles |
| Solid-State Transmitters | Tianjian TJD-FT01 | EW Jamming Systems | Instant-On Reliability |
| Military Power Modules | Xinle Energy LPT3000 | Naval Radar Power Systems | >95% Efficiency, MIL-704F Compliant |
Real-World Deployment Cases
| Product Category | Application Scenario | Solution Provider | Performance Highlights |
|---|---|---|---|
| Industrial Panel PCs | Smart Munitions Production | North China Industrial | -40°C Cold Start Operation |
| Robot Servo Drives | Armor Welding Automation | Benchuan Intelligent | Anti-EMI PCB Design |
| Marine-Grade PLCs | Warship Power Management | Siemens S7-1500 | Salt Spray Certification (MIL-STD-810G) |
| Machine Vision | Armored Vehicle QA Inspection | Keyence CV-X Series | ±0.01mm Defect Detection |
| Battlefield Comms Gateways | Real-Time Medical Data Processing | Advantech EIS-D210 | 5G Backhaul + Edge AI |
Vetted Partners for High-Reliability Electronics
| Region | Manufacturer | Military PCB Capabilities | Certifications |
|---|---|---|---|
| Asia | Zhen Ding Technology | Intel IC Substrates; 20+ Layer HDI | AS9100, ITAR |
| Shenghong Technology | NVIDIA AI Server Boards; Vietnam Facility Expansion | IATF 16949, ISO 13485 | |
| AT&S (Austria/CN) | TSMC CoWoS Packaging Partners | MIL-PRF-31032, NADCAP | |
| Americas | TTM Technologies | Aerospace/Mil-Spec Multilayers (MIL-4) | IPC 6012 Class 3, AS9100 |
| Shuredundant (Shure) | 5G Base Station RF Boards | ITAR, ISO 9001 | |
| EMEA/JPKR | Ibiden (Japan) | Advanced Substrate R&D (>10% Revenue Investment) | JIS-Q 9100, IPC-A-600G |
| Samsung Electro-Mech | HBM Substrates (HPC Applications) | ISO 14001, OHSAS 18001 | |
| Rapid OEM | Minkinzi | 24-Hour Quick-Turn Mil-Spec PCBA | IATF 16949, ISO 9001 |
| Jingxi Technology | Chip Decryption + Custom Mil-Spec PCB Solutions | ITAR, RoHS |
(Supply Chain Resilience + Performance Optimization)
✅ Material Sourcing Strategy
> Prioritize domestic MIL-SPEC components (e.g., Hongyuan MLCCs, AVIC Optoelectronics connectors) to mitigate geopolitical risks.
✅ Production Compliance
> Enforce full material traceability (UID) + blockchain-based supply chain audits.
> Ban restricted imported substances (REACH, DFARS).
✅ PCB Partner Selection
> High-Complexity Boards: Zhen Ding / AT&S (16+ layer HDI, IC substrates)
> Rapid Prototyping: Minkinzi (24-hour turnaround, IATF 16949)
> RF/Analog Designs: TTM Technologies (MIL-4 qualified)
✅ Test Validation
> Pre-qualify designs using MIL-STD-461G (EMC) + GJB 150A (Environmental) simulators.
Transform Your Defense Electronics Workflow
Leverage proven military development frameworks, vetted component ecosystems, and certified manufacturing partners to accelerate time-to-field while ensuring uncompromising reliability.
Contact our MIL-SPEC Solutions Team for a component audit or PCB DFM analysis today.
ownload Full Military PCB Design Guidelines (Includes GJB 150A Checklist)
Capability :

Minkinzi: Trusted Military-Grade PCBA Manufacturer | High-Reliability Electronics for Defense & Aerospace
When mission-critical performance under extreme conditions matters most, defense contractors, aerospace OEMs, and military system integrators trust Minkinzi — a certified, security-compliant PCBA manufacturer specializing in ultra-high-reliability electronic assemblies for the global defense industry.
With full compliance to GJB546B, MIL-STD-810G, and ISO13485 standards, Minkinzi delivers precision-engineered printed circuit boards and complete PCBA solutions designed to operate flawlessly across the harshest environments — from arctic tundras to desert combat zones and deep-space orbits.
Our proven expertise spans aerospace avionics, armored vehicle control systems, soldier-worn combat terminals, and radar signal processing platforms, making us a strategic partner for Tier-1 defense suppliers requiring unmatched quality, speed, and supply chain resilience.
We’ve delivered mission-ready electronics for some of the world’s most demanding applications. While many projects remain classified, here are selected declassified case studies showcasing our engineering excellence:
77GHz Millimeter-Wave Radar Board
Deployed in armored vehicle early warning systems; operates reliably from –40°C to +150°C with low phase loss and high RF stability.
Aerospace-Grade High-Temp PCB
Designed for satellite attitude control units; supports sustained operation from –55°C to +125°C, meeting ECSS-Q-ST-70-08C thermal cycling requirements.
Military Ruggedized Computer Motherboard
12-layer HDI interconnect design with multi-stage EMI shielding; resistant to shock, vibration, and electromagnetic interference (EMI/RFI).
Fighter Jet Avionics Module
20-layer blind & buried via PCB; validated against MIL-STD-810G for mechanical durability and airborne environmental stress screening (ESS).
Shipborne Ka-Band Communication Board
Fabricated using Rogers RO4350B high-frequency laminate; enables stable millimeter-wave transmission up to 40 GHz with minimal dielectric loss.
Soldier Combat Terminal PCBA
Fully tri-proof coated (salt mist/mold/humidity resistance); achieves IP68 ingress protection rating and long-term survivability in tropical climates.
Armored Vehicle Power Control Unit
Built with 30 oz thick copper PCB technology; capable of handling 100A instantaneous current surges without thermal degradation.
Radar Signal Processing Core Board
Industry-leading 100-layer ultra-high-density interconnect (HDI) board with ±0.05mm lamination alignment precision — enabling advanced beamforming and real-time data processing.
Military Medical Diagnostic Device PCBA
Manufactured in ISO13485-certified cleanrooms; complies with EMC Class B emissions limits for use in field hospitals and CBRN response units.
UAV Flight Control Rigid-Flex Assembly
Hybrid rigid-flex architecture enables compact integration into drone gimbals and flight controllers; tested for >100,000 bending cycles without failure.
Note: Over 70% of our military engagements involve sensitive or export-controlled technologies. A desensitized white paper detailing our secure manufacturing protocols, risk mitigation strategies, and anonymized project benchmarks is available upon NDA.
| Capability Area | Key Specification | Competitive Advantage |
|---|---|---|
| Ultra-High Layer Count PCBs | Up to 120-layer through-hole boards; layer-to-layer misregistration ≤ 3% | Only <5 global manufacturers can achieve this level of stack-up consistency at scale |
| Advanced Material Control | In-house production line for specialty laminates, including polyimide, PTFE, and ceramic-filled composites | Eliminates dependency on foreign material suppliers; ensures traceability and continuity |
| Strategic Parts Inventory | 2,000+ military-grade component SKUs stocked in bonded warehouse | Reduces lead time risk; responds to shortages within <72 hours — critical during global supply disruptions |
This combination of deep materials science insight, precision fabrication, and proactive inventory management allows Minkinzi to maintain 99.3% on-time delivery even during geopolitical supply shocks.
To meet urgent defense procurement timelines, we operate one of the most responsive high-mix, low-volume military electronics manufacturing networks in Asia.
| Performance Indicator | Our Capability | Enabling Support System |
|---|---|---|
| Monthly Output Capacity | 200,000㎡ PCB / 12 million solder joints (PCBA) | Powered by 32 fully automated SMT and THT lines, including X-ray BGA inspection and AOI stations |
| Prototype Turnaround | 24-hour quick-turn PCB assembly (standard complexity) 72-hour small-batch production (up to 500 units) | Dedicated military urgent-order channel with priority scheduling and accelerated DfX feedback |
| Secure Manufacturing Environment | Independent ESD-safe cleanroom workshop Biometric access control + CCTV surveillance Complies with GJB546B confidentiality standards | Ideal for ITAR-free but security-sensitive programs needing physical and digital isolation |
Whether you're developing a new generation fighter jet subsystem or upgrading legacy naval communication gear, Minkinzi offers scalable capacity without compromising security or quality.
Defense budgets demand value innovation. At Minkinzi, we deploy intelligent cost-reduction strategies that preserve — or even enhance — product reliability.
Replace imported resins like Huntsman MT curing agents with qualified domestic alternatives such as Hongchang Electronics’ high-Tg epoxy (≥180°C) — achieving 30% lower BOM costs while maintaining thermal robustness and CTE match.
For non-classified defense logistics and dual-use exports:
Operate a Cambodia-based facility serving NATO-aligned allies
Benefit from zero import tariffs under trade preference programs
Reduce labor expenses by 45% compared to China-based production
Maintain full QC oversight via centralized ERP and remote audit tools
This hybrid onshore-offshore model enables competitive pricing for international tenders while ensuring regulatory compliance (e.g., FAR/DFARS, REACH, RoHS).
Choosing the right PCBA vendor for military applications isn’t just about capability — it’s about trust, compliance, and long-term collaboration. Prioritize partners who meet these essential criteria:
✅ Demonstrated Experience Across Domains
Look for evidence of successful deployments in aerospace, ground combat systems, and individual soldier equipment — not just commercial repurposed tech.
✅ Vertically Integrated Special Materials Line
True independence requires control over base substrates, adhesives, and coating processes. Avoid vendors reliant on single-source imports vulnerable to sanctions or embargoes.
✅ Global Supply Chain Resilience Strategy
Ensure your supplier has an overseas compliant footprint to support export contracts, mitigate regional risks, and comply with alliance-specific procurement rules.
Minkinzi meets — and exceeds — all three. We hold Level 3 National Defense Security Clearance and are certified for Weapons and Equipment Research & Manufacturing in China.
Precision Engineering: From 100-layer radar backplanes to flexible UAV modules, we master the full spectrum of advanced interconnect technologies.
Supply Chain Sovereignty: Dual sourcing, stockpiled critical components, and alternative material qualifications ensure program continuity.
Speed Meets Security: Rapid prototyping doesn’t mean cutting corners — our fast-turn services include full test validation and documentation traceability.
Long-Term Partnership Focus: We co-develop with clients from concept to lifecycle support, offering DFM/DFT advisory, obsolescence planning, and repair/rework services.
If you’re working on next-generation defense electronics — whether space-hardened satellites, AI-powered battlefield sensors, or silent electric drive trains for stealth vehicles — Minkinzi provides the engineering depth, production agility, and security framework you need.
Request Our Classified Projects White Paper (NDA Required)
Schedule a Technical Consultation with Our Defense Solutions Team
Arrange a Virtual Factory Audit with Real-Time Line Monitoring Access
Minkinzi – Where Reliability Meets Readiness.
Advantages :

Minkinzi: Trusted Aerospace & Defense Contract Manufacturer | Full-Service PCB/PCBA Solutions
At Minkinzi, we are a high-reliability contract manufacturing partner serving the global military, aerospace, and defense industries with end-to-end electronics engineering and production services. From concept to mass deployment, we deliver precision-engineered PCB design, HDI fabrication, SMT assembly, testing, and full lifecycle supply chain support — all under stringent international standards.
Our mission is simple: Enable mission-critical innovation through trusted, secure, and compliant electronic manufacturing.
We provide a seamless integration of hardware and software development with advanced manufacturing — accelerating your time-to-market by up to 40% using tools like OptFuture™ simulation software.
Ultra-High Precision SMT Assembly:
Capable of mounting components as small as 0.25mm pitch QFN/BGA packages, supporting miniaturized avionics, guidance systems, and satellite modules.
Advanced PCB Fabrication Technologies:
Expertise in HDI (High-Density Interconnect), blind/buried vias, and rigid-flex boards for compact, high-performance applications.
Specialized Materials & Processes:
Proven experience with PTFE (Teflon), high-frequency laminates (Rogers, Tachyon), ceramic substrates, gold wire bonding, and conformal coating for extreme environments.
One-Stop Development Pathway:
From circuit design and signal integrity analysis to prototyping and volume production — we eliminate silos between R&D and manufacturing.
Ideal for radar systems, UAVs, missile control units, satellite transceivers, and space-rated electronics.
We understand that reliability isn’t optional in aerospace and defense — it’s existential.
Designed and manufactured PCBAs that meet MIL-STD-883 environmental stress screening and MIL-STD-461G electromagnetic interference (EMI) requirements.
Successfully delivered for missile guidance systems, satellite communication modules, and avionics platforms including contributions to China’s C919 commercial aircraft program.
Compliant with low outgassing material standards required by NASA and ESA for space missions.
Equipped to handle radiation-hardened, vibration-resistant, and wide-temperature-range (-65°C to +150°C) designs.
Secure Project Environment:
All military and classified projects operate within an isolated, ITAR-compliant workflow. We enforce strict data encryption, physical access controls, and confidentiality agreements (NDA + ITAR clauses).
In today’s volatile component market, resilience matters.
Domestic Substitution Capability:
Support for locally sourced FPGA, ADC/DAC, RFIC, and power management ICs, reducing dependency on foreign suppliers and mitigating geopolitical risks.
Flexible Order Fulfillment:
True prototype-to-production scalability — from 1-unit builds to medium-volume runs — ideal for rapid model iteration and low-rate initial production (LRIP).
Full Component Traceability:
Batch-level tracking from raw materials to final shipment. No gray-market or counterfeit parts — ever.
Perfect for defense primes, research institutions, and startups requiring fast-turn engineering validation without sacrificing compliance.
To ensure zero-failure performance, Minkinzi employs a comprehensive suite of inspection and test systems across every stage of production.
| Test Category | Equipment Used | Application |
|---|---|---|
| Electrical Performance | Flying Probe Tester, AOI (Automated Optical Inspection) | Continuity checks, solder joint defect detection |
| Environmental Reliability | Thermal Chamber (-65°C ~ +150°C), Vibration Table, Salt Spray Tester | Simulate thermal cycling, mechanical shock, humidity, corrosion |
| Material Analysis | XRF Spectrometer, Ultrasonic Coating Thickness Gauge | Verify RoHS compliance, plating thickness, material composition |
| Signal Integrity | Vector Network Analyzer (VNA), Time Domain Reflectometer (TDR) | Impedance control, insertion loss, crosstalk analysis |
| Non-Destructive Testing (NDT) | X-ray (AXI) for BGA, Fluorescent Penetrant Inspection | Internal voids, hidden cracks, micro-solder defects |
Every product undergoes multi-stage inspections, ensuring adherence to IPC-A-610 Class 3 — the highest standard for electronic assemblies used in life-supporting or flight-critical systems.
We don’t just claim quality — we prove it through independent audits and certifications.
| Certification | Scope & Relevance |
|---|---|
| AS9100D | The gold standard for aerospace quality management. Ensures consistent process control, risk mitigation, and continuous improvement. |
| ISO 9001:2015 | Foundational QMS framework integrated into daily operations. |
| Nadcap Accreditation | Special process certification for welding, non-destructive testing, and heat treatment — required by major OEMs. |
| IPC-A-610G Class 3 | Acceptability of electronic assemblies for high-performance, long-life products. |
| MIL-STD-883K | Test methods for microcircuits used in military/aerospace applications. |
| ISO 27001 | Protects sensitive design data against cyber threats and IP leakage. |
| ISO 14001 & QC080000 | Environmental management and hazardous substance control (RoHS, REACH). |
Our team conducts regular internal audits and third-party assessments to maintain certification currency and prepare for customer-specific qualification programs.
Developed EMI-resistant board for a tactical missile guidance unit.
Passed MIL-STD-461G radiated emissions and susceptibility tests.
Utilized multi-layer shielding, embedded capacitance layers, and selective conformal coating.
Manufactured L-band transceiver module for LEO satellites.
Employed ceramic substrate packaging, gold wire bonding, and low-outgassing encapsulants.
Cleared NASA ASTM E595 off-gassing requirements for space vacuum compatibility.
Replaced imported FPGA-based navigation module with fully domestic alternative.
Achieved functional parity while complying with civil aviation safety protocols.
Reduced lead times by 60% and eliminated import bottlenecks.
These cases demonstrate our ability to bridge cutting-edge technology, national strategic priorities, and global compliance.
To protect both intellectual property and operational continuity, Minkinzi implements robust safeguards:
Supply Chain Security Protocol
Full traceability via ERP-integrated lot tracking.
Ban on components sourced from sanctioned regions.
ITAR & Data Security Isolation
Dedicated cleanroom lines for defense work.
NDAs with engineers; encrypted file transfer; no cloud storage of sensitive designs.
Continuous Certification Maintenance
Annual AS9100 and Nadcap re-audits scheduled proactively.
On-site readiness for customer quality audits (CQA).
We treat every project as if failure were not an option — because in aerospace and defense, it truly isn’t.
Whether you're developing next-generation unmanned systems, upgrading legacy military avionics, or launching small satellites, Minkinzi offers the technical depth, regulatory rigor, and responsive service your mission demands.
Contact us now for:
Free DFM/DFA review
Prototype quotation (as fast as 7 days)
ITAR-compliant NDA execution
Sample submission and qualification testing
Based in China | Serving Global Aerospace & Defense Clients
www.minkinzi.com | sales@minkinzi.com |
Materials :

Minkinzi: Precision Manufacturing Partner for Demanding Military & Aerospace Applications
Minkinzi delivers end-to-end manufacturing solutions engineered for the extreme reliability and performance requirements of the military and aerospace sectors. Our certified facilities and deep expertise ensure mission-critical success.
1. Advanced Military-Grade PCB Fabrication Expertise:
High-Frequency & High-Speed PCBs: Utilizing ultra-low-loss materials (Dk ≤ 3.5, Df ≤ 0.002) like PTFE/ceramic substrates for superior signal integrity.
High-Layer-Count Complexity: Proven capability for 24+ layer builds (reference: Tianjin Prin benchmark).
Micro-Precision: Ultra-fine line/spacing down to ≤ 0.076mm, supported by micro-vias ≥ 0.2mm.
HDI & Rigid-Flex Specialization: Incorporating advanced blind/buried vias (10:1 aspect ratio).
Extreme Environment Resilience: Boards qualified for operational temperatures from -55°C to +260°C (validated in Minkinzi Aerospace applications).
Optimized Thermal Management: High-performance metal core PCBs (e.g., Aluminum substrates with thermal conductivity ≥ 8W/(m·K)), proven in demanding Minkinzi Industrial Control systems.
2. State-of-the-Art PCBA Manufacturing & Assembly:
Precision SMT: High-accuracy placement (±15μm CPK) supported by comprehensive 3D AOI and X-Ray inspection.
Controlled Soldering: Nitrogen reflow soldering with oxygen levels ≤ 50ppm for superior joint integrity.
Specialized Coating: Conformal coating compliant with stringent MIL-I-46058C standards.
Vacuum Assembly: Critical vacuum soldering/brazing processes (oxygen ≤ 5ppm) utilizing equipment like Wuxi Sifang furnaces.
3. High-Reliability Hardware Module Design & Build:
Rugged Power Supplies: Wide input range (28V-600V DC), high efficiency (≥92%), and exceptional vibration resistance (≥15G RMS, 20-2000Hz).
Mission-Critical RF/Comms: Expertise in L/S/C bands (1-8GHz) with high shielding effectiveness (≥90dB), meeting avionics standards like 18C919.
Precision Sensors & Controls: Ultra-high accuracy torque (±0.05%) and position (±0.05%) sensing modules.
4. Military-Spec Materials & Enclosure Engineering:
Qualified Components: Sourcing and integration of components rated for extreme temperatures (-55°C to +125°C per MIL-STD-883) and radiation tolerance (≥100krad TID, utilizing materials like PEKK).
Lightweight & Durable Housings: Expertise in magnesium-aluminum alloys (density ≤1.8g/cm³) and titanium alloys.
Robust Environmental Protection: Housings certified to IP67/IP68 standards (exemplified by Blue Torch rugged computer cases).
Specialized Finishes: Military green oxidation, conductive oxidation, with shot peening for enhanced durability.
5. Certified Quality & Rigorous Validation:
Stringent Quality Systems: Certified to AS9100D (Aerospace) and ISO9001 quality management standards.
Security Compliance: Holds Level 3 Military Confidentiality Certification.
Comprehensive Reliability Testing: HALT/HASS accelerated life testing, extended salt spray testing (≥500 hours – exceeding Minkinzi Automotive Electronics standards), and full environmental simulation.
Partner with Confidence: Minkinzi possesses the proven capabilities, stringent certifications, and specialized expertise to manufacture your most demanding military and aerospace hardware. From complex PCBs and PCBA to ruggedized modules and enclosures, we deliver the reliability required for satellites, launch vehicles, avionics, and ground systems.
Materials :

High-Reliability Military Electronics Manufacturing Solutions | Minkinzi Smart Factory
Empowering defense, aerospace, and advanced communication systems with end-to-end military-grade electronic manufacturing services (EMS), Minkinzi integrates premium material selection, precision processes, and intelligent digital production to deliver unmatched reliability under extreme conditions.
From phased array radar to space payloads and UAV avionics, our solutions are engineered to meet stringent MIL-STD, GJB, and AS9100D/NADCAP standards — accelerating time-to-deployment by up to 40%.
We maintain a strategic portfolio of high-performance substrates designed for mission-critical applications across temperature extremes, vibration stress, and high-frequency operation.
| Brand | Series/Model | Key Parameters | Military Applications | Supply Channel |
|---|---|---|---|---|
| Rogers | RO4350B™ | Dk=3.48@10GHz, Df=0.0037 | Phased Array Radar | World-Strong Components Mall |
| Taconic | RF-35™ | Dk=3.5, Df=0.0018 | 5G Secure Comms, EW Systems | Beijing Yuanliu Hongyuan |
| Taiyao | TU872SLK | Tg=220°C, Low Loss (Df=0.002) | Missile Guidance Units | Shenzhen Huaqiang PCB Market |
| Isola | FR408HR | Tg=180°C, CAF Resistant | Avionics Control Modules | Kehui Technology Authorized Agent |
Use Case: Ideal for mmWave radar, SATCOM, and encrypted data links requiring stable impedance and minimal signal loss.
| Brand | Series/Model | Features | Certification Standards |
|---|---|---|---|
| ShengYi Tech | S1170G | Tg=170°C, Halogen-Free | MIL-PRF-31032 |
| Panasonic | Megtron 6 | Df=0.0015@1GHz, Ultra-Low Loss | NASA Qualified |
| ZhongYing Tech | NY9200 | -196°C to +260°C Operating Range | GJB9001C Certified |
| Rogers | RO3003™ | Ceramic-filled PTFE, Phase Stable | Satellite Payloads (MIL-STD-202) |
Critical Advantage: Ensures circuit integrity from Arctic drones to re-entry vehicle electronics.
| Model | Structure & Features | Application Case |
|---|---|---|
| DuPont™ Pyralux AP8525R | Polyimide Base, >1 Million Bend Cycles | Airborne Foldable Antenna Arrays |
| Taihong TF-305 | Tear-Resistant Cu Foil, Peel >1.2N/mm | Soldier-Worn Tactical Radios |
Supply Strategy: Stocked inventory on 10 core materials (RO4350B, TU872SLK, FR408HR, etc.) enabling 72-hour rapid delivery for urgent defense projects.
Achieve full supply chain resilience with vetted domestic alternatives and globally certified components, all compliant with obsolescence management and long-lifecycle requirements.
| Category | Brand | Sample Model | Performance Highlights |
|---|---|---|---|
| Military Connector | Aerospace Electrical | J30J-37T | Vibration Resistant (50G), -55°C ~ +175°C |
| High-Reliability Cap | Hongming Electronics | CA45-T Series | ESR <5mΩ, Lifetime: 105°C / 5000h |
| Anti-Sulfuration Resistor | Fenghua Advanced | RJK Series | ±0.1% Tolerance, Industrial Pollution Resistant |
| Category | Brand | Model | Compliance & Authorization |
|---|---|---|---|
| Radiation-Hardened FPGA | Xilinx | XQR7VX690T | Space & LEO Satellite Ready (Radiation Tolerant) |
| Sealed Military Relay | TE Connectivity | 1432795-1 | MIL-DTL-38999 Certified |
| Lead-Free Solder Paste | Indium Corporation | NC-18F | Void Rate <5%, RoHS & REACH Compliant |
Supply Chain Security:
VMI (Vendor Managed Inventory) partnerships established
Critical material safety stock ≥ 6 months of consumption
Dual sourcing strategy for export-controlled items
Precision welding is non-negotiable in life-or-death systems. Our dual-wave soldering technologies ensure zero-defect interconnects even in ultra-dense, mixed-technology boards.
Localized nozzle control: ±0.1mm precision
Eliminates thermal damage to heat-sensitive ICs (reduces failure risk by 27%)
Enables complex backplane assemblies with through-hole power modules
Solder joint yield >99.95% – exceeds MIL-STD-883H Class K requirements
Inert atmosphere: O₂ <50 ppm
Reduces oxide formation and dross by up to 70%
Near-zero voiding ensures long-term corrosion resistance
Meets MIL-STD-883 Method 1004 moisture and climate endurance tests
Both processes integrated into AS9100D-certified lines with real-time SPC monitoring.
Leveraging Industry 4.0 principles, our global smart factories offer seamless traceability, predictive quality control, and scalable production capacity.
| Capability | Technology Implementation | Benefit |
|---|---|---|
| Smart Warehousing | AGV + WMS Integration | Material traceability accuracy: 99.99% |
| Real-Time Process Hub | MES Platform Monitoring 12+ Parameters (e.g., Reflow ±1℃) | Full recipe control & deviation alerts |
| AI-Powered Inspection | AOI + Deep Learning Algorithm | Defect detection rate >99.7%, false alarm <0.3% |
| Location | Specialty | Monthly Capacity | Certifications |
|---|---|---|---|
| Shenzhen HQ | 40-layer HDI, 01005 Mounting | 50,000㎡ PCB / 3M+ SMT cycles | AS9100D, NADCAP, ITAR Registered |
| Chonburi, Thailand | Fine-pitch BGA (0.3mm pitch), HDI | 80,000㎡ / month | ISO/TS22163, IATF16949 |
| Monterrey, Mexico | Rigid-Flex Boards, Encrypted Modules | 30,000㎡ / month | ITAR Registered, DFARS Compliant |
✅ Core Competitive Edge:
72-hour fast-turn prototype service
Integrated aluminum alloy CNC shielding enclosures (±0.005mm precision)
One-stop solution from design → materials → assembly → certification
Trusted by top-tier defense contractors and national research institutes.
UAV Lightweight Avionics: Delivered PEEK-CF composite substrate achieving 32% weight reduction without compromising structural integrity.
Long March Rocket Onboard Computer: Engineered rigid-flex board withstanding 100G impact during launch; operating flawlessly in vacuum environments.
Confidentiality & Compliance:
Certified at Level 3 State Secrets Protection Qualification
Listed in National Weapon & Equipment Manufacturing Catalog
Fully compliant with ITAR, EAR, and DFARS 252.225-7014
Customer Value Proposition: We fully empower your project lifecycle — from material selection to specialized process engineering and military standard certification — reducing mass production ramp-up time by up to 40%.
Are you developing next-gen radar, satellite comms, or battlefield IoT? Let us help you go from concept to qualification faster.
Contact Us Now:
Send your project specifications to sales@minkinzi.com
Receive a complete DFM (Design for Manufacturability) report within 24 hours
Fast-track your path to MIL-certified volume production
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Telephone: +86 0769 3320 0710
Cel/What's app: +86 134 6956 5519
Address 1:Songshan Lake International Creativity Design Industry Park,No. 10, West Industrial Road,Songshan Lake High-Tech Dist.,Dongguan,China.523808. Address 2:No. 18, Zhenyuan East Road, Chang 'an Town, Dongguan City, Guangdong Province.523000.
