Dear Partners, welcome to MINKINZI – China’s Trusted End-to-End Manufacturing Partner, with 20 years of expertise, we specialize in: Design & Development → PCB Fabrication → PCBA Assembly → Box-Build Assembly. ODM/OEM/Contract Manufacturing tailored to global standards. Support DFM. .
Description :
Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg).The electrical connection between each layer is usually realized by plated through hole. Multilayer PCB is one of the most complex types in printed circuit board.
Applications :
Flow Chart :
Capability :
| Rigid PCB Capability | ||
| Layers | ≦36 | |
| Materials | Standard FR4/Mid-Tg FR4/Hi-Tg FR4,CEM-1/CEM-3,PTFE,Rogers,Arlon,Taconic, Teflon,Isola,ITEQ,Dupont,Polyimide,Metal Core Material,Ventec,Nelco | |
| Max. PCB Panel Size | 1496mmx620mm | |
| Board Thickness | 0.2-12mm | |
| Board Thickness Tolerance | ±10% | |
| Min Conductor Line Trace/Space | Inner Layers:≧3/3mil(0.075/0.075mm for 1/2oz base Copper) | |
| Outer Layers:≧3.5/3.5mil | ||
| For Via in Pad | Resin plugged hole size | 0.3-0.75mm |
| Resin plugged board thickness | 0.3-8mm | |
| Resin plugged maximum aspect ratio | 20:1 | |
| Resin plugged minimum hole to hole space(mm) | 0.65mm | |
| For HDI | Min. mechanical drilling hole diameter | 0.15mm |
| Min. laser drilling hole diameter | 0.075mm | |
| Max. aspect(micro-via) | 1:1 | |
| Max. dielectric thickness for laser drill | 0.05-0.15mm | |
| Bottom pad size(under micro-via) | Hole Size+0.17mm | |
| Top side pad size(on micro-via) | Hole Size+0.15mm | |
| Copper filling | Y | |
| Via in pad design | Y | |
| Buried hole resin plugged | Y | |
| Min. via size can be copper filled | 0.075mm | |
| Min plated hole size | 20um(0.8mil) | |
| Min Blind/Buried hole size | 0.2mm(8mil) | |
| Min Annular Ring | ±0.076mm(±3mil) | |
| Min width of cutout (NPTH) | 0.8mm | |
| Min width of slot hole (PTH) | 0.6mm | |
| Solder mask color | green, red, blue, white, yellow, purple, black, orange, LPI, matt green | |
| Silkscreen color | White, Yellow, Red, Black | |
| Surface finish | ENIG, Immersion Tin, HASL, HASL-LF, OSP, Gold finger, Immersion Silver | |
| Outline | Routing, V-cut, Bridge, Stamp hole | |
| Outline Tolerance | ±0.15mm (±6mil) | |
| Hole Tolerance | PTH +/-3mil | |
| NPTH +/-2mil | ||
| Controled Impendence | +/-5%(<50Ω), +/-10%(≧50Ω) | |
| E-Test | Flying probe test:0.4-6.0mm, max 19.6"*23.5" | |
| Min spacing from test pad to board edge:0.5mm | ||
| Min conductive resistance:5Ω | ||
| Max insulation resistance:250mΩ | ||
| Max test voltage:500V | ||
| Min test pad diameter:6mil | ||
| Min test pad to pad spacing:10mil | ||
| Max test pad to pad spacing:10mil | ||
| Max test current:200MA | ||
| AOI | Orbotech SK-75 AOI:0.05-6.0mm, max23.5"*23.5" | |
| Orbotech Ves machine:0.05-6.0mm, max23.5"*23.5" | ||
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Telephone: +86 0769 3320 0710
Cel/What's app: +86 134 6956 5519
Address 1:Songshan Lake International Creativity Design Industry Park,No. 10, West Industrial Road,Songshan Lake High-Tech Dist.,Dongguan,China.523808. Address 2:No. 18, Zhenyuan East Road, Chang 'an Town, Dongguan City, Guangdong Province.523000.
